Hermetic Sealed Joint Structure for Implantable Micro Packages
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Solution Overview
Problem
Existing sealed joint structures for implantable micro package devices fail to ensure effective biocompatibility and hermetic sealing, leading to potential corrosion and intrusion of hazardous substances due to inadequate sealing and packaging reliability.
Innovation Solution
A sealed joint structure is developed, featuring a buffer bump layer with a patterned annular portion and conductive joint portions, which forms a hermetic space between the device and the substrate using a joint ring, enhancing sealing and packaging while reducing process steps and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional sealing structures are used for implantable micro package devices, then the device can be packaged, but the sealing reliability is insufficient leading to corrosion and hazardous substance intrusion
Solution Approach 1:
The sealing structure is divided into multiple functional segments: a buffer bump layer with annular portion for stress distribution and sealing, conductive joint portions for electrical connection, and a joint ring for hermetic sealing. This segmentation allows each component to specialize in its function, improving overall sealing reliability while preventing harmful factors.
Solution Approach 2:
The invention uses composite material structures combining different materials with complementary properties: the buffer bump layer provides mechanical compliance, the conductive joint portions provide electrical conductivity, and the joint ring provides hermetic sealing. This composite approach ensures both sealing reliability and protection against corrosion and hazardous substance intrusion.
2Reliability
If separate sealing and packaging processes are used, then each function can be optimized, but the process complexity and cost increase
Solution Approach 1:
The invention merges the sealing function and packaging function into a single integrated sealed joint structure. The buffer bump layer, conductive joint portions, and joint ring work together to simultaneously provide hermetic sealing, electrical connection, and mechanical packaging, eliminating the need for separate sealing and packaging processes while maintaining high reliability.
Solution Approach 2:
The sealed joint structure is designed as a multi-functional component that performs multiple functions simultaneously: hermetic sealing to prevent contamination, electrical connection for signal transmission, and mechanical packaging for device protection. This universality reduces process complexity and cost while ensuring packaging reliability.
Data Source
AI summary
A sealed joint structure of device includes a buffer bump layer, conductive joint portions and a sealed joint portion. The buffer bump layer disposed between a device and a substrate includes first parts and a second part surrounding the first parts. Each of the conductive joint portions includes a first electrode covering each of the first parts and a second electrode on the substrate, and each of the first electrodes is electrically connected to the second electrode. The sealed joint portion includes a joint ring located on the substrate and is jointed with the second part to form a hermetic space between the device and the substrate.