Sealed Key Assembly Structure for Corrosion-Resistant Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic devices are exposed to harsh environments, such as high humidity and air pollution, which can cause contamination and corrosion of internal components, particularly affecting key assemblies.
Innovation Solution
The electronic device incorporates a key assembly with a housing that includes an opening, a key assembly partially exposed through the opening, and a sealing member between two plates to protect internal components from environmental factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a mechanical keyboard is used, then typing satisfaction is improved, but the device thickness increases
Solution Approach 1:
The key assembly is nested within the display assembly, with the key cap positioned at the front surface of the display assembly and the key support structure integrated into the display assembly's internal space. This nesting approach allows the mechanical keyboard functionality to be incorporated without significantly increasing the overall device thickness.
Solution Approach 2:
The key support structure utilizes the Z-axis dimension by extending upward from the display assembly's internal layer to support the key cap at the front surface. This dimensional arrangement allows the key assembly to be distributed across multiple layers, maintaining a compact profile while providing mechanical keyboard functionality.
2Device complexity
If the key assembly structure is simplified, then device complexity is reduced, but key stability deteriorates
Solution Approach 1:
The key assembly is segmented into three main components: the key cap, the key support structure, and the connection structure. This segmentation allows each component to be optimized independently for its specific function while maintaining overall structural stability through well-defined connection interfaces.
Solution Approach 2:
The connection structure merges the key support structure with the display assembly by extending from the front surface to the rear surface, creating a unified and stable integration. This merging ensures that the key cap remains stable during use while keeping the overall structure relatively simple.
3Ease of operation
If the key cap is exposed at the front surface, then typing satisfaction is improved, but the key assembly occupies more internal space
Solution Approach 1:
The key cap is positioned at the front surface of the display assembly, exposed for user interaction, while the supporting structures are nested within the internal space of the display assembly. This arrangement minimizes internal space occupation while maintaining typing satisfaction.
Solution Approach 2:
The key support structure is designed to be flexible yet stable, allowing it to adapt to the available internal space while providing sufficient support for the key cap. This dynamic design enables the key assembly to function effectively within constrained internal dimensions.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
An electronic device according to an embodiment disclosed herein may comprise: a housing that includes an opening formed on one surface; and a key assembly formed to be at least partially exposed through the opening. The key assembly may include: a first plate; a second plate which is disposed on the first plate and includes a first hole formed at a position corresponding to the opening and a second hole spaced apart from the first hole; a key which is disposed between the first plate and the second plate and at least a portion of which passes through the first hole; a printed circuit board which is electrically connected to the key and at least a portion of which is disposed at a position corresponding to the second hole; a sealing member which is disposed between the first plate and the second plate and includes a third hole corresponding to the first hole and a fourth hole corresponding to the second hole; and a bonding member which is applied inside the second hole to bond a portion of the printed circuit board to the second plate.