Sealed LED Light Module with Gasket Seal
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Solution Overview
Problem
Exposure of heat sinks in LED light fixtures to the environment allows water ingress, which can cause acidic water to damage the printed circuit board, leading to costly repairs and downtime.
Innovation Solution
A sealed LED light module design featuring a cover plate, gasket material, and bottom covering that provides an environmental seal, preventing water entry and protecting the circuit board and LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat sink is exposed to the environment for heat dissipation, then the cooling efficiency is improved, but water ingress occurs causing damage to the circuit board
Solution Approach 1:
The light fixture is divided into separate sealed modules: the circuit board assembly is enclosed in a sealed housing with gaskets, while the heat sink remains exposed. This segmentation allows the circuit board to be protected from water ingress while the heat sink maintains environmental exposure for effective heat dissipation.
Solution Approach 2:
A sealed housing structure with gasket material acts as an intermediary barrier between the circuit board and the external environment. The gasket material specifically prevents water ingress while allowing thermal energy to pass through, protecting the circuit board without compromising heat dissipation.
2Reliability
If the printed circuit board is sealed to prevent water ingress, then reliability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The system is segmented into a sealed circuit board housing and an exposed heat sink. The circuit board assembly is enclosed with gasket material to prevent water ingress, while the heat sink remains separately exposed to the environment for effective heat dissipation.
Solution Approach 2:
The sealed housing with gasket material serves as an intermediary that protects the circuit board from water while allowing thermal energy to transfer to the externally exposed heat sink, maintaining both reliability and heat dissipation capability.
3Stability of the object's composition
If fastening devices are used to secure the circuit board, then structural stability is improved, but water ingress paths are created
Solution Approach 1:
The fastening devices are extracted from the circuit board itself and relocated to the housing structure. The circuit board is secured to the housing using fastening devices that attach to the housing rather than penetrating the circuit board, eliminating the creation of water ingress paths through the circuit board while maintaining structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sealed design effectively prevents water and moisture from reaching the internal components, enhancing the reliability and longevity of LED light fixtures by shielding them from environmental hazards.
Implementation Method 1
The gasket material can be disposed within the groove. The bottom covering can be disposed adjacent to the circuit board and coupled to the cover plate. The gasket material can provide a seal between the cover plate and the bottom covering.
Implementation Method 2
The heat sink is typically made of heat conductive aluminum alloy and may provide heat dissipation to allow proper cooling of the LEDs.
Data Source
AI summary
A light module includes a cover, a circuit board, a gasket, a bottom covering, and an optional optic assembly. The cover includes an inner and an outer wall extending outwardly from the cover, where the outer wall surrounds the inner wall and forms a groove therebetween. The circuit board is positioned within the inner wall's profile and includes a plurality of LEDs. The gasket is disposed within the groove. The bottom covering is positioned adjacent to the circuit board and is coupled to the cover. The gasket provides a seal between the cover and the bottom covering. The optic assembly is disposed within the inner wall's profile and between the cover and the circuit board. The optic assembly includes one or more apertures and one or more optics disposed around at least some of the apertures. Each optic is aligned with one or more LEDs.