Sealed LED Package Structure for Moisture-Resistant Reliability
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Solution Overview
Problem
There is a need for an LED package that can maintain reliability over long periods of exposure by preventing the infiltration of foreign substances, moisture, and other contaminants into its interior.
Innovation Solution
The LED package includes a light emitting diode chip, a wavelength conversion layer, a transparent layer, and a wall portion forming an accommodating space. The transparent layer is connected to the inner surface of the wall portion, ensuring the accommodating space is closed from the outside, thereby preventing foreign substances and moisture from entering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the LED package is exposed to the outside for extended periods, then lighting and display functions are enabled, but foreign substances and moisture infiltrate the interior causing reliability degradation
Solution Approach 1:
The patent applies a transparent seal layer that forms a hermetic barrier over the LED chip and wavelength conversion layer, preventing foreign substances and moisture from infiltrating the package interior while maintaining long-term reliability during external exposure
Solution Approach 2:
The package structure is divided into distinct functional layers including the LED chip, wavelength conversion layer, and transparent seal layer, with each layer serving a specific purpose in light generation, conversion, and protection respectively
2Reliability
If a thick transparent layer is used to seal the package, then protection from contaminants is improved, but light transmission efficiency decreases
Solution Approach 1:
The transparent seal layer is optimized with specific thickness parameters (t3) that are smaller than the light transmission substrate thickness (t1), balancing the competing requirements of contaminant protection and light transmission efficiency
Solution Approach 2:
The package employs a composite structure combining the light transmission substrate, wavelength conversion layer with phosphors, and transparent seal layer, where each material is selected for its specific optical and protective properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the LED package by effectively sealing it from external contaminants, ensuring long-term performance and preventing light intensity imbalance and optical efficiency decreases.
Implementation Method 1
a wavelength conversion layer (200) disposed above the light emitting diode chip (100), which generates light of a second color by being excited by the light of the first color
Data Source
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AI summary
The present disclosure relates to a light emitting diode package. Particularly, according to one embodiment of the present disclosure, there may be provided a light emitting diode package (1) including: a light emitting diode chip (100) that generates light of a first color; a wavelength conversion layer (200) disposed above the light emitting diode chip (100), which generates light of a second color by being excited by the light of the first color; a transparent layer (300) disposed above the wavelength conversion layer (200); and a wall portion (400) forming an accommodating space in which the light emitting diode chip (100) and the wavelength conversion layer (200) are accommodated. The wall portion (400) includes an inner surface (401) surrounding the accommodating space, and the transparent layer (300) is connected to the inner surface (401) of the wall portion (400) so that the accommodating space is closed from an outside.