Sealed Liquid Cooling Module With Conduction Surface for Dense Electronics
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Solution Overview
Problem
Current cooling methods for electronic components, particularly in data processing centers, face inefficiencies due to high thermal resistance and the need for substantial energy consumption, often relying on air as a transfer medium which limits server density and increases costs.
Innovation Solution
A sealable module with a housing and heat transfer device featuring a conduction surface that separates a volume for a first cooling liquid from a channel for a second cooling liquid, allowing efficient heat conduction between the two liquids, reducing thermal resistance and eliminating the need for vapor-cycle refrigeration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air is used as a transfer medium for heat, then the system can operate with simple infrastructure, but the thermal resistance increases and server density must be limited
Solution Approach 1:
The patent introduces a liquid cooling intermediary system where coolant channels are integrated into the server housing structure. This liquid intermediary replaces air as the heat transfer medium, enabling efficient heat removal while maintaining system compactness. The coolant acts as a mediator between the heat-generating components and the external heat sink.
Solution Approach 2:
The patent applies hydraulic cooling principles by circulating liquid coolant through channels formed within the server housing. This hydraulic system enables controlled heat transfer through pumped fluid circulation, replacing passive air cooling and allowing for higher server density and improved thermal management efficiency.
2Temperature
If air conditioning is used to reduce local air temperature, then the temperature difference increases improving heat transfer, but substantial electrical power is consumed
Solution Approach 1:
The patent changes the fundamental parameter of heat transfer medium from gas (air) to liquid (coolant). This parameter change enables more efficient heat transfer at higher temperatures without requiring additional cooling power, as liquids have superior thermal conductivity and heat capacity compared to gases.
Solution Approach 2:
The patent replaces the mechanical air conditioning system (vapor-compression refrigeration) with a direct liquid cooling system. This substitution eliminates the need for compressors, condensers, and evaporators, significantly reducing electrical power consumption while maintaining effective heat removal.
3Reliability
If air pressurisation is used to increase air flow rate, then thermal resistance decreases, but the location becomes unpleasant due to noise and temperature
Solution Approach 1:
The patent replaces pneumatic air cooling with hydraulic liquid cooling. The liquid coolant circulates through closed channels, providing silent operation without the noise associated with high-speed air fans and pressurization systems. This hydraulic approach also eliminates the need to maintain large, noisy air flow rates.
4Reliability
If servers are distributed sparsely to reduce heat density, then local air flow improves reducing thermal resistance, but server density decreases
Solution Approach 1:
The patent implements liquid cooling channels within the server housing structure, enabling high-density server configurations. The liquid coolant efficiently removes heat from compact server arrangements, eliminating the need for sparse distribution and large air flow paths, thereby maximizing server density while maintaining effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces thermal resistance, maintains the cooling liquid in a liquid state, decreases energy consumption, and allows for increased server density by enhancing heat transfer efficiency, thus effectively managing heat in high-heat environments like data processing centers.
Implementation Method 1
the conduction surface separating the volume and the channel to allow conduction of heat between the volume and the channel through the conduction surface
Data Source
AI summary
A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.