Sealed Liquid-Metal Mesh Heat Radiator for Low-Resistance GPU Cooling
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Solution Overview
Problem
Liquid metal used for heat transfer in electronic components is prone to leakage due to its fluidity and generates thermal resistance when interposed between heat generation elements and heat radiation components, especially in portable devices subjected to vibration.
Innovation Solution
A heat radiation component featuring a mesh impregnated with liquid metal, covered by two film bodies with sealed peripheries and strategically formed openings, allowing the mesh to directly abut the electronic component without interposing thermal interface materials, thereby preventing leakage and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If liquid metal is used as thermal interface material, then heat transfer property is improved, but leakage occurs due to fluidity under vibration and impact
Solution Approach 1:
The patent uses a mesh structure as a porous material to contain the liquid metal. The mesh allows the liquid metal to be held in its voids while maintaining thermal contact with the heat generation element, preventing leakage under vibration and impact while preserving heat transfer properties
Solution Approach 2:
The patent creates a composite structure combining the mesh (structural component) with liquid metal (thermal interface material). This composite approach allows the mesh to provide mechanical stability and containment while the liquid metal provides excellent thermal conductivity, resolving the contradiction between heat transfer and leakage resistance
2Reliability
If thermal interface material is interposed between heat generation element and heat radiation component, then heat transfer is facilitated, but thermal resistance is generated
Solution Approach 1:
The patent extracts the thermal interface material function from a separate layer and integrates it directly into the heat radiation component through the mesh structure. This eliminates the need for additional TIM layers, reducing the number of interfaces and associated thermal resistance while maintaining effective heat transfer
Solution Approach 2:
The patent merges the thermal interface material (liquid metal) with the heat radiation component structure (mesh). By combining these functions into a single integrated component, the patent eliminates the thermal resistance that would exist at the interface between separate TIM and heat spreader layers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively absorbs and radiates heat from electronic components without leakage, reducing thermal resistance and simplifying assembly by eliminating the need for additional thermal interface materials.
Implementation Method 1
The liquid metal has higher heat transfer property than the grease having the heat transfer property, and can effectively transfer heat from the die to the heat radiation component
Implementation Method 2
a mesh impregnated with a liquid metal, and two film bodies that cover both surfaces of the mesh and have sealed peripheries
Data Source
AI summary
A heat radiation component radiates heat from a GPU that generates heat, and includes a mesh impregnated with a liquid metal, and two film bodies that cover both surfaces of the mesh and have sealed peripheries. An opening is formed in the film body. In the mesh, an exposed portion that is exposed through the opening abuts on a surface of a die of the GPU. In the mesh, the portion exposed through the opening is formed of two layers, a first layer and a second layer. In the mesh, an area of the exposed portion exposed through the opening is smaller than an area of the other portion.