Sealed Liquid-Metal Mesh Interface for Low-Resistance GPU Heat Transfer

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Solution Overview

Problem

Liquid metal used for heat transfer in electronic components is prone to leakage due to vibration and has inherent thermal resistance when interposed between heat generation elements and heat radiation components.

Innovation Solution

A heat radiation component with a mesh impregnated with liquid metal, covered by two film bodies with sealed peripheries and openings, allowing the mesh to directly abut the electronic component without interposing thermal interface materials, thereby preventing leakage and reducing thermal resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If liquid metal is used as thermal interface material between die and heat radiation component, then heat transfer property is improved, but leakage occurs due to fluidity under vibration and impact

Engineering Contradiction:
Improveheat transfer propertyVSAvoidleakage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent uses a mesh structure as the heat radiation component, which is impregnated with liquid metal. The mesh provides a porous framework that contains the liquid metal through capillary action, preventing leakage while maintaining excellent heat transfer properties. The liquid metal fills the spaces within the mesh structure, ensuring stable thermal contact without requiring additional sealing mechanisms.

Inventive Principle:
Principle #31Porous materials

2Reliability

If liquid metal is interposed between heat generation element and heat radiation component, then heat transfer is improved, but thermal resistance is generated

Engineering Contradiction:
Improveheat transfer propertyVSAvoidthermal resistance
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent eliminates the separate thermal interface material layer by making the mesh itself the heat radiation component that directly contacts the die. The liquid metal is impregnated within the mesh structure rather than being applied as a separate interface layer, thereby removing the additional thermal resistance that would be introduced by multiple material interfaces while maintaining effective heat transfer.

Inventive Principle:
Principle #2Taking out (Extraction)

3Object-affected harmful factors

If grease having heat transfer property is used as thermal interface material, then leakage is prevented, but heat transfer property is reduced compared to liquid metal

Engineering Contradiction:
Improveleakage preventionVSAvoidheat transfer property
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

Instead of using grease to prevent leakage, the patent employs a mesh structure that provides mechanical containment through its porous framework. The mesh physically holds the liquid metal in place through capillary forces and structural support, eliminating the need for grease while preserving the superior heat transfer properties of the liquid metal.

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively absorbs and radiates heat from electronic components without leakage, reducing thermal resistance by eliminating the need for thermal interface materials and ensuring reliable heat transfer.

Implementation Method 1

The liquid metal has higher heat transfer property than the grease having the heat transfer property, and can effectively transfer heat from the die to the heat radiation component

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat radiation component that radiates heat from an electric component that generates heat

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentEP4312258A1Heat radiation component and electronic apparatus
Publication Date: 2024.01.31 LENOVO (SINGAPORE) PTE LTD
  • EP4312258A1 patent drawingFigure 1
  • EP4312258A1 patent drawingFigure 2
  • EP4312258A1 patent drawingFigure 3

AI summary

Provided is a heat radiation component that does not cause leakage of a liquid metal and can reduce a thermal resistance with an electric component. A heat radiation component radiates heat from a GPU that generates heat, and includes a mesh impregnated with a liquid metal, and two film bodies that cover both surfaces of the mesh and have sealed peripheries. An opening is formed in the film body. In the mesh, an exposed portion that is exposed through the opening abuts on a surface of a die of the GPU. In the mesh, the portion exposed through the opening is formed of two layers, a first layer and a second layer. In the mesh, an area of the exposed portion exposed through the opening is smaller than an area of the other portion.