Sealed Micro LED Unit Pixel Structure for Adhesive Protection
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Solution Overview
Problem
Micro LEDs in micro LED displays are difficult to handle due to their small size, and adhesives used to mount them on display panels are prone to damage or deformation from environmental factors like heat and moisture, affecting the display's performance.
Innovation Solution
A unit pixel design with a transparent substrate, adhesive layer sealed inside, and protective layers such as a step adjustment layer and protection insulation layer to prevent adhesive damage, along with a light blocking layer and etching stop layer to enhance durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesives are used to mount micro LEDs on display panels, then the micro LEDs can be fixed in position, but the adhesives are prone to damage or deformation from environmental factors like heat and moisture
Solution Approach 1:
The adhesive mounting structure is segmented into multiple functional layers: a lower adhesive layer for mounting the micro LED, an upper encapsulation resin layer for environmental protection, and intermediate structures like reflective layers and planarization layers. This segmentation allows each layer to specialize in its function, with the upper layer shielding the vulnerable adhesive layer from environmental factors.
Solution Approach 2:
The encapsulation resin layer is applied beforehand to cover and protect the adhesive layer from environmental factors such as moisture and heat before they can cause damage. This protective layer acts as a cushion against environmental harm, preventing the adhesive from deforming or failing during device operation and testing.
2Productivity
If micro LEDs are directly mounted on display panels, then the display can be manufactured, but the small size of micro LEDs makes them difficult to handle and mount
Solution Approach 1:
An intermediary adhesive layer and encapsulation structure are introduced between the micro LED and the final display panel position. This intermediary mounting structure allows for easier handling and positioning during assembly, as the adhesive layer provides a controlled bonding interface and the encapsulation resin protects the mounted LED during subsequent manufacturing steps.
Solution Approach 2:
The micro LED is preliminarily mounted on the adhesive layer within the encapsulation structure before final integration into the display panel. This preliminary mounting allows for easier handling and positioning, and the structure can be adjusted or replaced if needed before final assembly, improving overall manufacturing efficiency.
3Reliability
If protective layers are added to seal the adhesive layer, then environmental damage is prevented, but the device structure becomes more complex
Solution Approach 1:
The encapsulation resin layer serves multiple functions simultaneously: it protects the adhesive layer from environmental factors, provides mechanical support, enables planarization of the surface, and can incorporate reflective layers for optical enhancement. By making this single layer multi-functional, the patent reduces the need for additional separate protective layers, thereby limiting the increase in structural complexity.
Solution Approach 2:
Multiple protective and functional elements are merged into a single encapsulation resin layer structure. The encapsulation resin combines environmental sealing, mechanical protection, and optical functions in one integrated layer, rather than using separate layers for each function. This merging approach provides comprehensive protection while maintaining relatively simple device structure.
Data Source
AI summary
A unit pixel according includes a transparent substrate, a plurality of light emitting devices disposed on the transparent substrate, and an adhesive layer disposed between the light emitting devices and the transparent substrate to bond the light emitting devices. The adhesive layer is sealed inside the unit pixel.


