Sealed Module Structure With Exposed Component for Heat Dissipation
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Solution Overview
Problem
Conventional modules face limitations in effectively radiating heat generated from components mounted on a substrate, as the existing sealing resins do not adequately enhance heat dissipation performance.
Innovation Solution
A module design featuring a substrate with a component having a projecting portion that protrudes from the sealing resin, combined with a metal shield film and a marking portion, enhances heat radiation by increasing the exposed surface area and utilizing materials with higher thermal conductivity for improved heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the component is completely sealed with sealing resin, then the sealing performance and protection are improved, but the heat radiation performance deteriorates
Solution Approach 1:
The sealing resin is applied selectively: it seals the lateral sides of the component for protection, but intentionally leaves the upper surface exposed. This local differentiation allows simultaneous achievement of sealing performance on sides and heat radiation from the exposed surface.
Solution Approach 2:
The component is designed with a projecting portion that extends vertically from the substrate. This three-dimensional structure provides additional surface area for heat radiation while maintaining compact footprint, allowing heat dissipation without increasing planar area.
2Temperature
If the exposed surface area of the component is increased, then the heat radiation performance is improved, but the device complexity increases
Solution Approach 1:
The component structure is segmented into a mounted portion on the substrate and a projecting portion extending upward. This segmentation creates additional exposed surface area for heat radiation without requiring complex external heat sinks or additional components.
Solution Approach 2:
The projecting portion of the component serves multiple functions: it provides the primary heat radiation surface, maintains electrical connection through the substrate, and enables compact vertical integration. This multi-functionality avoids adding separate heat dissipation components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves heat radiation performance by increasing the exposed surface area of the component and utilizing materials with higher thermal conductivity, allowing for more efficient heat transfer and compact module integration, suitable for miniaturized devices.
Implementation Method 1
utilizing materials with higher thermal conductivity for improved heat transfer
Implementation Method 2
performance to radiate heat generated from the component increases
Data Source
AI summary
A module includes a substrate, a first component, and a sealing resin. The substrate is provided with a first surface. The first component is mounted on the first surface. The first component is sealed with the sealing resin at least from a lateral side. The first component includes a projecting portion. The projecting portion projects from the sealing resin on a side opposite to a side of the substrate.