Sealed Module Multi-Path Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional communications modules face challenges in effectively managing heat generated by internal electronic components, especially in harsh environments where open configurations are needed for cooling, leading to susceptibility to moisture and debris exposure.
Innovation Solution
A sealed communications module with a multi-path thermal management system that includes first, second, and third thermal pathways to efficiently dissipate heat from heat-generating components to the exterior surfaces without allowing airflow through the module, using heat spreaders, insulative layers, heat pipes, and heat sinks integrated into the module's housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an open configuration is used to allow airflow through the module interior for cooling, then heat dissipation is improved, but the module becomes susceptible to moisture, water, dust, and debris exposure
Solution Approach 1:
The thermal management system is segmented into multiple independent pathways (first thermal pathway with heat spreader and heat pipe, second thermal pathway with heat sink, third thermal pathway with vapor compression cycle) that can operate independently. This segmentation allows heat to be dissipated through multiple routes without requiring open airflow, resolving the contradiction between effective cooling and environmental protection.
Solution Approach 2:
The patent introduces intermediary thermal management components (heat spreaders, heat pipes, heat sinks, vapor compression cycle system) that act as mediators between the heat-generating components and the external environment. These intermediaries transfer heat without requiring direct airflow through the module interior, thus preventing moisture and debris ingress while maintaining effective heat dissipation.
2Object-affected harmful factors
If a sealed configuration is used to protect against moisture and debris, then environmental protection is improved, but heat dissipation becomes difficult
Solution Approach 1:
The patent employs a vapor compression cycle system (third thermal pathway) that uses refrigerant phase change and circulation to transfer heat from the sealed module interior to the exterior. This pneumatic/hydraulic-based thermal transfer mechanism enables effective heat dissipation through the sealed configuration without requiring airflow, thus maintaining both environmental protection and thermal management.
Solution Approach 2:
The vapor compression cycle system utilizes phase transitions of the refrigerant (evaporation and condensation) to transfer heat. The refrigerant absorbs heat from the module interior during evaporation and releases heat to the exterior during condensation, enabling efficient heat dissipation through the sealed configuration without compromising environmental protection.
3Temperature
If large and complex cooling systems are used to manage heat, then heat dissipation capacity is improved, but device complexity increases
Solution Approach 1:
The thermal management system is divided into three distinct pathways with different functions and mechanisms. This segmentation allows each component to be optimized independently and simplifies the overall system design compared to a single large complex cooling system. The modular structure makes it easier to manufacture, assemble, and maintain while providing comprehensive heat dissipation capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages heat dissipation from internal components to the exterior, maintaining a sealed and protected environment while preventing moisture and debris ingress, thus enhancing module performance and longevity in harsh conditions.
Implementation Method 1
heat spreaders, insulative layers, heat pipes, and heat sinks integrated into the module's housing
Implementation Method 2
heat spreaders, insulative layers, heat pipes, and heat sinks integrated into the module's housing
Implementation Method 3
heat sinks integrated into the module's housing
Implementation Method 4
heat sinks integrated into the module's housing
Implementation Method 5
heat spreaders, insulative layers, heat pipes, and heat sinks integrated into the module's housing
Data Source
AI summary
A thermal management system for use in a sealed communications module and associated systems and methods are disclosed herein. In some embodiments, the communications model includes a sealed housing and a circuit board assembly having one or more heat-generating electronic components positioned within the housing. The thermal management system is coupled to the circuit board assembly and positioned to disperse heat from the one or more electronic components. The thermal management system includes a first thermal pathway, a second thermal pathway, and a third thermal pathway. The first thermal pathway has a first end attached to the circuit board assembly and a second end positioned near the side wall of the housing. The second thermal pathway is coupled to the second end of the first thermal pathway. The third thermal pathway is coupled to the second end of the first thermal pathway.