Sealed Circuit Module Marking for Heat Dissipation Without Added Thickness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic circuit modules face challenges in heat dissipation while maintaining a thin profile and ensuring clear identification marks, as they rely on additional components like aluminum plates which increase thickness and reduce visibility of identification characters and marks.
Innovation Solution
An electronic circuit module design featuring a board with mounted components and a sealing resin that includes identification recesses filled with a thermally conductive filler, which also serves as an identification mark, preventing the need for additional heat dissipation components and enhancing visibility and identifiability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If an aluminum plate is stacked in addition to heat dissipating grease to form identification marks, then identification visibility is improved, but the thickness of the device increases
Solution Approach 1:
The patent merges the heat dissipation function and identification mark function into a single integrated structure. The identification mark is formed by creating a recess in the heat dissipation plate itself, eliminating the need for a separate aluminum plate stack. This combines multiple functions (heat dissipation + identification) into one component, resolving the contradiction between visibility and thickness.
Solution Approach 2:
The patent extracts the identification mark formation from a separate layer and integrates it into the heat dissipation plate structure. By forming recesses directly in the heat dissipation plate and filling them with reflective material, the identification function is extracted and embedded within the existing thermal management component, avoiding additional thickness.
2Length of moving object
If only the unevenness of the aluminum plate is used to form marks, then device thickness is reduced, but identifiability and visibility of the mark cannot be sufficiently obtained
Solution Approach 1:
The patent applies the principle of optical property changes by filling the recesses with material having different reflective properties than the surrounding heat dissipation plate. This creates high-contrast visual identification marks through reflectivity differences, ensuring sufficient visibility and identifiability while maintaining a thin profile.
Solution Approach 2:
The patent applies local quality by creating recesses with different surface properties (filled with reflective material) in specific locations on the heat dissipation plate. This allows identification marks to have enhanced visual properties locally while the rest of the plate maintains its heat dissipation function, achieving both thinness and visibility.
3Temperature
If multiple layers (aluminum plate and heat dissipating grease) are stacked for heat dissipation, then heat dissipation capability is improved, but device thickness increases
Solution Approach 1:
The patent combines the heat dissipation plate and identification mark structure into a single integrated component. The heat dissipation plate serves dual purposes: thermal management and providing the substrate for identification marks. This merging eliminates redundant layers and reduces overall device thickness while maintaining effective heat dissipation.
Solution Approach 2:
The heat dissipation plate is designed to perform multiple functions: it dissipates heat from the electronic component and simultaneously provides the structural basis for identification marks through its recesses. This multi-functionality reduces the need for separate components, thereby reducing device thickness while maintaining heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat without increasing module thickness and improves the visibility and identifiability of identification marks by using a thermally conductive filler within the sealing resin, while preventing short circuits and optimizing heat dissipation.
Implementation Method 1
an identification recess constituting at least one of an identification character and an identification mark when viewed from a thickness direction of the board is formed in an upper surface of the sealing resin, and wherein the identification recess is filled with a filler made of a material having a higher thermal conductivity than a material of the sealing resin
Data Source
AI summary
To provide electronic circuit module capable of dissipating heat generated by electronic component while suppressing increase in thickness, and capable of improving identifiability and visibility of identification character and identification mark as compared with conventional technique. Electronic circuit module according to present disclosure includes board, plurality of electronic components mounted on upper surface of board; and sealing resin configured to cover electronic component. Sealing resin has lower surface in contact with upper surface of board, and upper surface positioned on opposite side from board with respect to electronic component to face in opposite direction from lower surface. Identification recess constituting at least one of identification character and identification mark when viewed from thickness direction of board is formed in upper surface of sealing resin. Identification recess is filled with filler made of material having higher thermal conductivity than material of sealing resin.