Sealed Multi-Die Package Structure for Solder and Thermal Reliability
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Solution Overview
Problem
Conventional packaging technologies for multi-die packages face challenges such as solder fatigue, glob-top bleeding control issues, and poor thermal conductivity, leading to reliability and thermal resistance problems in electronic devices.
Innovation Solution
A packaging solution involving a die with perimeter metallization, a multi-layer laminate package substrate, and a seal that creates an air-filled cavity around resonators, providing improved mechanical support, thermal management, and reduced package height, while eliminating the need for wafer-level packaging and glob-top encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If glob-top encapsulation is used for multi-die packaging, then manufacturing cost is reduced, but solder fatigue reliability deteriorates
Solution Approach 1:
The invention divides the package into separate sealed enclosures for each die, with individual solder connections, rather than using a single glob-top encapsulation. This segmentation allows each die to have its own protected solder joints while eliminating the need for glob-top material, thus maintaining low cost while improving solder fatigue reliability through proper sealing and underfill techniques.
2Device complexity
If glob-top encapsulation is used, then manufacturing complexity is reduced, but controlling glob-top bleeding becomes difficult
Solution Approach 1:
The invention extracts and eliminates the glob-top encapsulation material from the manufacturing process entirely. By removing this problematic element, the patent avoids all associated bleeding control issues while still achieving the necessary protection and sealing functions through alternative means (sealed enclosures with proper underfill), thus reducing manufacturing complexity without sacrificing precision.
3Ease of manufacture
If bare die packaging is used, then manufacturing cost is reduced, but thermal resistance increases
Solution Approach 1:
The invention employs composite material structures including sealed enclosure materials, thermally conductive underfill, and metal tray components. These composite materials work together to provide both cost-effectiveness and improved thermal management, allowing heat to be efficiently conducted away from the dies while maintaining the economic advantages of bare die packaging approaches.
4Area of stationary object
If close die-to-die placement is used, then package area is reduced, but glob-top bleeding control becomes more difficult
Solution Approach 1:
The invention replaces the glob-top encapsulation material with disposable or replaceable sealed enclosure components and underfill materials that are specifically designed for close-spaced die arrangements. This approach allows for precise control in tight spaces without the bleeding problems of glob-top, maintaining small package area while achieving manufacturing precision.
Data Source
AI summary
Disclosed are apparatuses and techniques for fabricating single or multi-die packages with sealed enclosures. In one or more aspects an apparatus includes a die; a perimeter metallization disposed on a perimeter of the die; a package substrate; and a seal coupled to the perimeter metallization and the package substrate, configured to seal the die to the package substrate.