Sealed Optical Module Assembly for Liquid-Cooled Fiber Interfaces
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Solution Overview
Problem
The increasing power consumption and cooling limitations of optical modules, particularly in high-speed transmission systems, are exacerbated by the use of air cooling, while liquid cooling methods like immersing switches in coolants lead to contamination and operational issues due to non-sealed optical paths and components being exposed to coolants.
Innovation Solution
The optical module design includes a shell with a circuit board and optical transceiver component, an optical cable fixation member with crimping rings and protective sleeves, and an isolation member with seals to prevent coolant ingress, ensuring sealed optical paths and components are protected.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling methods are used to overcome air cooling limitations, then cooling capacity is improved, but optical components are exposed to coolant contamination
Solution Approach 1:
The optical module is divided into separate sealed and unsealed regions. The optical components are enclosed in a sealed cavity that is isolated from the coolant, while other parts of the module can benefit from liquid cooling. This segmentation allows the system to achieve effective cooling without exposing optical components to coolant contamination.
Solution Approach 2:
A sealed housing or enclosure acts as an intermediary barrier between the optical components and the coolant. This sealed structure allows the optical components to remain protected from coolant while still enabling liquid cooling of other module components through dedicated cooling channels or heat sinks that do not directly contact the optical elements.
2Ease of operation
If optical paths are left open for accessibility, then ease of operation is improved, but reliability deteriorates due to coolant ingress
Solution Approach 1:
The optical components are extracted and placed in a separate sealed enclosure that is independent from the main module body. This allows the optical path to be hermetically sealed against coolant ingress while maintaining accessibility through dedicated sealed interfaces or removable sealed covers that preserve the seal integrity when properly closed.
Solution Approach 2:
Sealed covers or protective caps are designed to be simple, lightweight structures that can be easily attached and removed. These sealed covers provide temporary protection during operation and can be replaced if needed, maintaining reliability while allowing accessibility when properly sealed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents coolant seepage into optical components, maintaining operational integrity and reducing contamination, thereby enhancing the reliability and performance of optical modules in high-speed transmission systems.
Implementation Method 1
a tenth seal wrapping a broken surface of the broken cable sheath and an outer wall of the unbroken optical fiber
Implementation Method 2
an optical fiber which is extended from outside of the shell into a first cavity provided in an engaging part of the optical cable fixation member
Data Source
AI summary
An optical module includes: a circuit board; an optical chip; a lens assembly covered on the optical chip, a first seal exists between the lens assembly and the circuit board, the lens assembly is provided with a wrapping cavity and is provided with a recessed optical port groove and a blocking assembly at least partially covered on the optical port groove, and the optical port groove has a reflective surface; an optical fiber holder fixedly connected to an optical fiber at one end and fixed in the wrapping cavity at the other end, a second seal is located between respective side faces of the optical fiber holder and outer side faces of three side walls of the wrapping cavity away from the circuit board, and around a side wall of the wrapping cavity close to the circuit board.