Sealed Optical Transceiver Immersion Cooling

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Solution Overview

Problem

Conventional optical transceivers are not compatible with immersion cooling due to interference of liquid with optical propagation, and existing liquid-compatible transceivers are bulky and expensive.

Innovation Solution

A sealed optical transceiver design with a light propagation path sealed from the ambient environment, using an optical block, electro-optic elements, and a component cavity to prevent liquid interference, allowing operation immersed in a liquid.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional optical transceivers are used with air cooling, then optical propagation is maintained, but heat removal efficiency is insufficient and packaging density is limited

Engineering Contradiction:
Improvecomponent operating temperatureVSAvoidcompatibility with immersion cooling
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The transceiver is divided into separate sealed modules (optical engine, electrical components) that can be independently hermetically sealed and then immersed in coolant. This segmentation allows the optical paths to be protected from liquid while enabling efficient heat removal from electrical components through immersion cooling.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Hermetic seals and encapsulation materials act as intermediaries between the optical components and the liquid coolant environment. These intermediary layers prevent liquid ingress into optical paths while allowing thermal energy to transfer from electrical components to the coolant.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If hermetically sealed metal enclosures are used to protect optical paths from liquid, then optical performance is maintained in immersion, but device complexity and cost increase

Engineering Contradiction:
Improveoptical performance stability in liquidVSAvoidenclosure structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Thin-film hermetic seals and flexible encapsulation layers are used instead of bulky metal enclosures. These thin-film barriers provide sufficient protection against liquid ingress while maintaining compact form factors and reducing overall device complexity.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

Multiple sealed modules are nested within each other in a hierarchical structure, with optical engines nested within electrical assembly housings. This nested arrangement maximizes packaging density while minimizing the number of external密封 interfaces required.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Productivity

If optical transceivers are sealed for liquid operation, then immersion cooling is enabled, but packaging density may be reduced due to seal structures

Engineering Contradiction:
Improveheat removal efficiencyVSAvoidtransceiver volume
Core Design Contradiction:
ProductivityVSVolume of moving object

Solution Approach 1:

The hermetic seals serve multiple functions simultaneously: they provide liquid ingress protection, enable thermal conduction paths for cooling, and provide structural support for component mounting. This multi-functionality eliminates the need for separate cooling structures, maintaining compact volume.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Composite封装 structures combining metal, ceramic, and polymer materials are used to achieve optimal balance between hermetic sealing performance, thermal conduction efficiency, and mechanical strength. This allows effective heat removal through immersion cooling without requiring excessive material volume.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient heat removal and increased packaging density while maintaining optical performance, even in harsh environments, without the need for costly hermetic enclosures.

Implementation Method 1

Direct liquid contact to the components results in a lower component operating temperature

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

immersion cooling, where the optical interconnection elements, as well as other electrical components in the system, are submersed in a liquid

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

optical transceivers, which convert electrical signals to optical signals and optical signals to electrical signals

Methodology Applied
Scientific EffectElectro-optic conversion: Electro-Optic Effects

Data Source

PatentUS20250189731A1Sealed optical transceiver
Publication Date: 2025.06.12 SAMTEC INC
  • US20250189731A1 patent drawing
  • US20250189731A1 patent drawing
  • US20250189731A1 patent drawing

AI summary

This present disclosure seals the light propagation path in an optical interconnection element from external contaminants. The optical interconnection element includes a reflective surface, which can also be sealed from external contaminants. Additional novel concepts include all enclosed sealed regions of the optical interconnection element being fluidly connected and making the final seal of the optical interconnection element with a thin plate, which can bend reducing the pressure differential between the ambient environment and the sealed internal volume of the optical interconnection element.