Sealed Liquid-Filled Power Adapter for Compact Heat Dissipation
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Solution Overview
Problem
High-power mobile phone power adapters face challenges with heat dissipation due to their small size, leading to excessive local temperatures and potential component overload, with existing solutions either providing slow heat dissipation, affecting electromagnetic compatibility, or having long curing times and difficulty in controlling dispensing ranges.
Innovation Solution
A power adapter design that encloses a circuit board assembly in a sealed cavity filled with thermally conductive liquid, ensuring even heat distribution through sealed guide connectors and airtightness, without affecting electrical performance, thus enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the power adapter is miniaturized to reduce size, then portability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent uses a liquid cooling system where a pump circulates coolant through channels in the housing to actively remove heat from the power adapter components. This hydraulic approach enables effective heat dissipation in a compact form factor by introducing a fluid circulation system that efficiently transfers heat away from high-power components.
Solution Approach 2:
The patent introduces a thermal interface material or heat transfer medium between the circuit board and the housing cooling channels. This intermediary substance facilitates efficient thermal coupling, allowing heat to be transferred from the small circuit board components to the larger housing cooling structure, thereby resolving the heat dissipation limitation in miniaturized adapters.
2Power
If high-power components are used to increase charging speed, then power output is improved, but heat generation increases
Solution Approach 1:
The patent converts the harmful heat generated by high-power components into a manageable thermal flow by designing integrated heating elements or PTC (positive temperature coefficient) materials that utilize the heat for beneficial purposes such as preventing condensation or providing controlled warming, while the cooling system simultaneously removes excess heat.
Solution Approach 2:
The patent employs PTC materials whose electrical resistance changes with temperature, allowing the system to dynamically adjust power delivery and heat generation. When components reach certain temperature thresholds, the PTC effect automatically reduces current flow and heat generation, providing active thermal management that enables sustained high-power operation without dangerous heat accumulation.
3Device complexity
If conventional heat dissipation methods are used, then device simplicity is maintained, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent merges the structural housing with the cooling system by integrating cooling channels directly into the housing walls and using the housing itself as a heat sink. This combination eliminates the need for separate cooling components, maintaining structural simplicity while achieving high heat dissipation efficiency through the unified thermal management design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves rapid and efficient heat dissipation, preventing component overload and allowing for a smaller adapter size while maintaining performance, thereby improving user experience.
Implementation Method 1
heat emitted by the circuit board assembly during operation may be quickly transferred from a high-temperature side to a low-temperature side through the thermally conductive liquid
Implementation Method 2
the housing body and the rear cover are connected in a sealed manner
Data Source
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AI summary
This application provides a power adapter. The power adapter includes a housing body, a rear cover, a circuit board assembly, a first guide connector, a second guide connector, and a thermally conductive liquid. The housing body has an opening, the rear cover is fastened to the housing body and covers the opening, the housing body and the rear cover are connected in a sealed manner and enclose to form an accommodating cavity, the circuit board assembly is disposed in the accommodating cavity, the thermally conductive liquid fills the accommodating cavity and wraps the circuit board assembly, the housing body includes a front end wall disposed opposite to the rear cover, the first guide connector is mounted on the front end wall and connected to the front end wall in a sealed manner, the second guide connector is mounted on the rear cover and is connected to the rear cover in a sealed manner, and both the first guide connector and the second guide connector are electrically connected to the circuit board assembly. The power adapter provided in this application has a good heat dissipation effect.