Sealed Pressure Pad With Flexible Layers For Semiconductor Joining
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Solution Overview
Problem
Existing methods for connecting semiconductor components using low temperature joining techniques face challenges with the long-term stability and reliability of joints due to mechanical damage and contamination from pressure pads, and limitations in achieving high contact pressures and even pressure distribution.
Innovation Solution
The apparatus and method involve a sealed pressure pad with heatable plungers and flexible layers between the upper and lower dies, allowing for relative movement and compensation of height differences, minimizing direct contact of pressure pads with components and ensuring even pressure distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a sealed pressure pad is used to connect components, then even pressure distribution is achieved, but mechanical damage and contamination from the pressure pad occur
Solution Approach 1:
A flexible membrane is introduced as an intermediary between the pressure pad and the components. The membrane transmits the pressing force uniformly while preventing direct contact, thereby avoiding mechanical damage and contamination of the components. This resolves the contradiction by allowing even pressure distribution without the harmful effects of direct pressure pad contact.
Solution Approach 2:
The patent employs a flexible membrane (thin film) that conforms to the component surfaces while transmitting pressure. This flexible barrier provides uniform pressure distribution across the component surface without causing mechanical damage or contamination, as the membrane protects the components from direct contact with the rigid pressure pad.
2Reliability
If high contact pressures are applied to ensure reliable joints, then connection reliability improves, but mechanical damage to components increases
Solution Approach 1:
The flexible membrane serves as a mediator that allows high contact pressures to be applied for reliable joint formation while protecting the components from mechanical damage. The membrane distributes the high pressure uniformly and prevents stress concentration that would cause component damage.
Solution Approach 2:
The patent changes the physical state and properties of the pressure transmission medium by using a flexible membrane instead of direct rigid contact. This allows the system to maintain high contact pressure for joint reliability while the membrane's flexibility prevents mechanical damage through stress distribution.
3Productivity
If multiple components are connected simultaneously, then productivity increases, but achieving even pressure distribution becomes difficult
Solution Approach 1:
The flexible membrane provides a universal solution for connecting multiple components simultaneously. It can adapt to different component configurations and heights, ensuring even pressure distribution across all components in the assembly, thereby enabling high-productivity multi-component connections without sacrificing pressure uniformity.
Solution Approach 2:
The flexible membrane conformally contacts multiple components of varying heights and shapes, distributing pressure evenly across all components during simultaneous connection. This flexibility enables productive multi-component assembly while maintaining manufacturing precision through uniform pressure application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and stability of connections by preventing mechanical damage and contamination, achieving high contact pressures, and maintaining consistent joint parameters, while allowing for the use of heat-sensitive materials and simultaneous connection of multiple components.
Implementation Method 1
the plungers and the pressure pad have a first flexible layer between them
Implementation Method 2
the upper die and the lower die have a second flexible layer arranged between them
Implementation Method 3
the upper die has at least two heatable plungers
Data Source
AI summary
An apparatus for connecting at least two components contains a lower die and an upper die. The lower die has the components which are to be connected, with the first component supporting the at least second component with an at least partial overlap relative to the first component. The lower die and the upper die can be moved relative to one another. The upper die carries at least two heatable plungers which are connected so as to be able to move relative to one another via a sealed pressure pad. The plungers and the pressure pad have a first flexible layer between them. A second flexible layer is arranged between the upper die and the lower die.