Sealed Structure Resin Compression Molding Flow Mark Control
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Solution Overview
Problem
The challenge in semiconductor packaging is the occurrence of flow marks and uneven thickness distribution in curable resin compositions during compression molding, particularly when forming thin films over large substrate areas, which can lead to defects and spoil the appearance of the sealed body.
Innovation Solution
A method involving a printing step to form a first coating film followed by compression molding with a controlled S1/S2 area ratio of 0.9 or more, where S1 is the projected area of the first coating film and S2 is the projected area of the second coating film, to reduce thickness variations and suppress uneven distribution of the solid component, thereby minimizing flow marks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a curable resin composition in liquid form is compression-molded onto a substrate, then the substrate can be sealed, but the distribution of components becomes uneven causing flow marks to appear
Solution Approach 1:
The patent applies a printing process before compression molding to pre-distribute the curable resin composition uniformly on the substrate. This preliminary action ensures that components are evenly distributed before the sealing process, preventing flow marks while maintaining sealing quality
Solution Approach 2:
The patent controls the area ratio S1/S2 between the printed resin layer and the mold cavity as a key parameter. By optimizing this ratio, the patent achieves both uniform component distribution and effective sealing, resolving the contradiction between sealing quality and manufacturing precision
2Volume of moving object
If the coating film of curable resin composition is made thinner to achieve miniaturization, then the sealed structure becomes smaller, but flow marks become more likely to occur
Solution Approach 1:
The printing process is applied before compression molding to pre-distribute the curable resin composition uniformly. This preliminary action ensures that even when forming thin coating films, the components remain evenly distributed, preventing flow marks while achieving miniaturization
Solution Approach 2:
The patent introduces the area ratio S1/S2 as a controlled parameter to optimize the printing and molding process. By adjusting this parameter, the patent can form thin coating films without causing component distribution issues, thus preventing flow marks while achieving smaller sealed structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses flow marks and thickness variations, even when forming thin films over large areas, resulting in a uniform and defect-free sealed structure without the need for an abrading process, thus enhancing the appearance and reliability of the sealed body.
Implementation Method 1
In the case of forming a thin molded portion, however, the fluid pressure sometimes causes the internal elements to be damaged
Implementation Method 2
a second step of sealing the substrate with the curable resin composition, to form a sealed body including the substrate and a cured product of the curable resin composition
Data Source
AI summary
A method of producing a sealed structure, the method including: preparing a substrate and a curable resin composition in a liquid form; and sealing the substrate with the curable resin composition, to form a sealed body including the substrate and a cured product of the curable resin composition. The sealing step includes: printing the curable resin composition onto the substrate, to cover the substrate with a first coating film of the curable resin composition; and compression-molding the first coating film and the substrate together using a mold, with a pressing surface of the mold abut against the first coating film, to convert the first coating film into a second coating film. A ratio of a projected area S1 of the first coating film onto the substrate to a projected area S2 of the second coating film onto the substrate: S1/S2 is 0.9 or more.