Sealed Semiconductor Memory With Segmented Coils
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Solution Overview
Problem
Current digital recording devices have limited lifespan, requiring frequent data migration and incurring high costs, while existing wireless data communication technologies face challenges in achieving high-speed data transfer and reliable power supply without interference.
Innovation Solution
A sealed semiconductor memory with read-only memory blocks, each equipped with separate coils for power reception and data communication, using time division and phase-shifting mechanisms to prevent electromagnetic wave interference, and sealed with a silicon nitride film for durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate coils for power reception and data communication are provided, then wireless power supply and high-speed data communication can be achieved without interference, but device complexity increases
Solution Approach 1:
The patent divides the wireless communication function into separate coils: one coil dedicated for power reception and another coil dedicated for data communication. This segmentation prevents electromagnetic interference between power transmission and data transmission, enabling both functions to operate reliably without mutual interference.
2Productivity
If time division and phase-shifting mechanisms are used to prevent electromagnetic wave interference, then high-speed data communication is enabled, but device complexity increases
Solution Approach 1:
The patent employs time division multiplexing where power reception and data communication are performed in alternating time slots. During one period, power is transmitted; during the next period, data is communicated. This periodic action prevents electromagnetic interference while enabling high-speed data transfer.
Solution Approach 2:
The patent changes the phase of electromagnetic waves to differentiate between power transmission and data communication signals. By adjusting phase parameters, the system can separate the two functions in the electromagnetic domain, preventing interference and enabling high-speed communication.
3Duration of action of stationary object
If the semiconductor substrate is sealed with silicon nitride film, then moisture-induced corrosion is prevented and device lifespan is extended, but manufacturing complexity increases
Solution Approach 1:
The patent uses a thin silicon nitride film to seal the semiconductor substrate, creating a hermetic barrier that prevents moisture penetration. This thin-film sealing approach protects the internal metal wiring from corrosion, extending device lifespan to 100 years or more while maintaining manufacturing feasibility.
4Reliability
If multiple read-only memory blocks are provided without shared power source, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent divides the memory device into multiple independent read-only memory blocks, each with its own dedicated power source. This segmentation ensures that a failure in one block's power source does not affect other blocks, thereby improving overall system reliability and data preservation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-speed wireless data communication and reliable power supply without interference, extending device lifespan and reducing manufacturing costs, while maintaining high reliability and preventing moisture-induced corrosion.
Implementation Method 1
a coil for power reception and a coil for data communication are provided
Implementation Method 2
sealed with a silicon nitride film for durability
Data Source
AI summary
The invention relates to a sealed semiconductor recording medium and a sealed semiconductor memory and provides at low cost a sealed semiconductor memory with high reliability that can allow wireless data communication to be carried out at high speed without interference. At least one semiconductor substrate is provided with a number of read only memory blocks having such a size that the maximum side is 20 mm or less in such a state that the read only memory blocks do not share a power source wire, wherein each of the above-described read only memory blocks has a coil for power reception and a coil for data communication, and data different from each other are written in the above-described read only memory blocks.


