Sealed Sensor Assembly With Direct Pin Attachment for Harsh Environments
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing sensing solutions for harsh environments suffer from manufacturing complexity and reduced sensing quality due to the separation of electronic and sensing portions, leading to inadequate durability and increased costs.
Innovation Solution
A sensor assembly with an integrated circuit (IC) sensor chip and electrical connection pins sealed by a sealing material, directly attached to a sensor mounting body, eliminating intermediate connections and enhancing sealing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic portions are separated from sensing portions in harsh environments, then durability is improved, but manufacturing complexity increases and sensing quality decreases
Solution Approach 1:
The sensor assembly is segmented into a sensing portion (IC sensor chip in the harsh environment) and an electronic portion (electronic components in the protected environment), connected via sealed passages through the mounting body. This segmentation allows each portion to be optimized for its specific environment while maintaining overall system functionality.
Solution Approach 2:
The mounting body acts as an intermediary structure that houses both the sensing portion in the harsh environment and the electronic portion in the protected environment. It provides sealed passages for electrical connections and mechanical support, eliminating the need for complex external wiring and connection devices.
2Reliability
If electronic portions are removed from harsh environments, then component durability improves, but sensing accuracy deteriorates due to additional disturbance factors
Solution Approach 1:
The sensing portion and electronic portion are merged within a single sealed mounting body structure, allowing the IC sensor chip to remain in the harsh environment where it can sense physical properties accurately without external interference, while the electronic processing occurs in the protected environment.
Solution Approach 2:
The mounting body provides a sealed enclosure that protects the electronic portion while allowing the sensing portion to interface with the harsh environment. The sealing portions create flexible barriers that maintain the integrity of the protected environment while enabling sensing functionality.
3Strength
If intermediate connection devices are used to attach sensing means to mounting body, then structural reinforcement improves, but manufacturing costs increase and exposure to harsh environment increases
Solution Approach 1:
Intermediate connection devices such as printed circuit boards and other intermediary connection devices are extracted from the design. The IC sensor chip is directly attached to the mounting body structure, eliminating unnecessary components and reducing manufacturing complexity and costs.
Solution Approach 2:
The electrical connection pins extend through the mounting body from the first side to a second side, creating a three-dimensional connection path that eliminates the need for intermediate two-dimensional connection planes. This direct attachment reduces the number of manufacturing steps and materials required.
4Measurement precision
If IC sensor chip is placed in harsh environment, then sensing accuracy improves, but sealing requirements increase to protect electrical connections
Solution Approach 1:
The mounting body serves multiple functions simultaneously: it provides mechanical support for the IC sensor chip, creates sealed passages for electrical connections, defines the harsh environment interface, and protects the electronic portion. This multi-functionality reduces the need for separate sealing components.
Solution Approach 2:
The mounting body can be constructed from composite materials or multiple materials with different properties optimized for specific functions: thermal conductivity for heat dissipation, sealing properties for protecting electrical connections, and mechanical strength for structural support in harsh environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved accuracy and reduced manufacturing costs while ensuring durability in harsh environments, such as high pressure and high temperature conditions, by integrating the IC sensor chip directly with the mounting body and using sealing materials to protect the electrical connections.
Implementation Method 1
A passage of each one of the electrical connection pins through the sensor mounting body is sealed by a sealing portion made of a sealing material
Implementation Method 2
the support structure can be positioned in contact with a thermal pad of the package of the sensing means, thus serving as heat sink
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
The invention relates to a sensor assembly for the sensing of a physical property, in particular humidity and/or pressure and/or temperature, in a first environment. The sensor assembly comprises a sensor mounting body (103, 503), a sensing means (105) for sensing the physical property, and a plurality of electrical connection pins (107, 107a, 107b, 207, 307). The sensor mounting body (103, 503) comprises a first side (113) for interfacing the first environment (101).The sensing means (105) is arranged over the first side (113), wherein the sensing means (105) comprises an integrated circuit (IC) sensor chip and a package (127) for the IC sensor chip. Each of the plurality of electrical connection pins (107, 107a, 107b, 207, 307) extends through the sensor mounting body (103, 503) from the first side (113) to a second side (115) of the sensor mounting body (103, 503). A passage (129, 129a, 129b, 529) of each one of the electrical connection pins (107, 107a, 107b, 207, 307) through the sensor mounting body (103, 503) is sealed by a sealing portion (131, 131a, 131b, 531) made of a sealing material. Each one of the electrical connection pins (107, 107a, 107b, 207, 307) is directly attached to the package (127) of the sensing means (105).