Sealed Temperature Sensor Module With Exposed Heat-Conductive Path

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The detection accuracy of temperature sensors in electronic devices may decrease due to the configuration of the temperature sensor module.

Innovation Solution

Incorporating a heat-conductive member with higher thermal conductivity than the sealing member, which is thermally connected to the temperature sensor and exposed to be in contact with the part to be measured, thereby improving heat transfer and detection accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the temperature sensor is sealed in a resin sealing member, then the temperature sensor is protected from environmental damage, but the detection accuracy decreases due to poor thermal conductivity of the sealing member

Engineering Contradiction:
Improveprotection of temperature sensorVSAvoiddetection accuracy
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The sealing member is divided into two distinct parts: a first sealing portion made of resin that provides environmental protection, and a second sealing portion made of a material with high thermal conductivity that enables accurate temperature detection. This segmentation allows each part to fulfill its specific function without compromising the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the sealing member are assigned different material properties: the first sealing portion uses resin for protection, while the second sealing portion uses a thermally conductive material for accurate temperature measurement. This local differentiation of material quality resolves the contradiction between protection and measurement accuracy.

Inventive Principle:
Principle #3Local quality

2Measurement precision

If a heat-conductive member is added to improve thermal transfer, then the detection accuracy improves, but the device complexity increases

Engineering Contradiction:
Improvedetection accuracyVSAvoidstructure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The heat-conductive member is merged with the sealing member to form an integrated second sealing portion. This combination eliminates the need for separate heat-conductive components while maintaining improved thermal transfer, thus enhancing detection accuracy without proportionally increasing device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The second sealing portion serves multiple functions: it provides environmental sealing like the first portion, while simultaneously acting as a heat-conductive path for accurate temperature detection. This multi-functionality reduces the need for additional components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of a heat-conductive member enhances the transfer of temperature from the part to be measured to the temperature sensor, thereby improving detection accuracy and reducing errors.

Implementation Method 1

a heat-conductive member that is thermally connected to the temperature sensor and made of a material with higher thermal conductivity than the sealing member

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250172434A1Temperature sensor module and electronic device
Publication Date: 2025.05.29 DENSO CORP
  • US20250172434A1 patent drawing
  • US20250172434A1 patent drawing
  • US20250172434A1 patent drawing

AI summary

A temperature sensor module includes a temperature sensor that outputs a detection signal corresponding to a temperature. The module has a mounting portion where the temperature sensor is mounted. A sealing member encapsulates the temperature sensor and the mounting portion. Additionally, the module includes a heat-conductive member that is thermally connected to the temperature sensor and made of a material with higher thermal conductivity than the sealing member. The heat-conductive member is arranged within the sealing member so that a part of the heat-conductive member is exposed from the sealing member. The heat-conductive member is designed to be in contact with a part to be measured.