Sealed Soldering Line for Electrode Erosion Control
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Solution Overview
Problem
Existing soldering methods face challenges in achieving high reliability and low cost with high yield, as they either suffer from poor productivity or fail to adequately address electrode erosion, leading to inconsistent solder quality and reduced substrate reliability.
Innovation Solution
A space-saving soldering device and method that utilizes a sequential treatment process with sealable units to control exposure to organic fatty acid solutions and molten solder, forming a uniform electrode erosion prevention layer and minimizing defects, while preventing oil odor leakage and optimizing treatment times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the screen plate method is used to form connecting solder, then the productivity is improved with precise paste bump formation, but the device complexity increases
Solution Approach 1:
The complex screen plate structure is extracted and replaced by a simpler molten solder dipping system. Instead of using a screen plate with precisely controlled openings, the invention uses a straightforward dipping mechanism where the substrate is immersed in molten solder. This extraction of the screen plate component significantly reduces device complexity while maintaining productivity through the dipping process.
Solution Approach 2:
The mechanical screen plate system is replaced with a thermal field-based molten solder dipping system. Rather than relying on mechanical precision of screen plate openings, the invention uses the fluid properties and surface tension of molten solder to achieve connecting solder formation. This substitution of mechanical complexity with thermal and fluid dynamics simplifies the overall device structure.
2Manufacturing precision
If the dipping time is extended to ensure complete solder coverage, then the solder quality improves, but the electrode erosion increases
Solution Approach 1:
The dipping time parameter is precisely controlled and optimized for each treatment part. By adjusting the dipping time to an optimal value that is neither too short nor too long, the process achieves complete solder coverage while minimizing electrode erosion. This parameter optimization balances solder quality and electrode preservation.
Solution Approach 2:
The dipping process is made continuous and synchronized across all treatment parts. All segments of the substrate are exposed to molten solder simultaneously for the same duration, ensuring uniform solder coverage throughout. This continuous synchronized action prevents both insufficient coverage and excessive erosion that would occur with non-uniform timing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of substrates and electrical components with highly reliable electrodes at low cost and high yield, preventing electrode erosion and maintaining solder quality across various mounting processes.
Implementation Method 1
causes the component to make contact with an organic fatty acid-containing solution
Implementation Method 2
causes the molten solder to be adhered onto the electrode
Implementation Method 3
separated in a sealable manner by a first opening-closing unit
Data Source
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AI summary
Provided is a space-saving soldering device that can perform allowing high-reliability soldering at a low cost and a high yield be produced at low cost with a high yield. For achieving the above-described objects, the soldering device includes: a first treatment part that sets a component having an electrode; a second treatment part separated by an opening-closing unit, the second treatment part sending the component on to a third treatment part; the third treatment part separated by an opening-closing unit, the third treatment part causing the component to contact an organic fatty-acid-containing solution and move horizontally; a fourth treatment part having a unit for moving the component to a space portion and causing molten solder to adhere to the electrode, and a unit for removing excess molten solder; a fifth treatment part for horizontally moving the component moved downward by the fourth treatment part; a sixth treatment part separated by an opening-closing unit, the sixth treatment part sending the component on to a seventh treatment part; and the seventh treatment part separated by an opening-closing unit, the seventh treatment part taking out the component.