Sealed SPI Device Thermal Management via Dielectric Isolation
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Solution Overview
Problem
Existing devices for storing and processing information face limitations such as insufficient resistance to environmental impacts, mechanical loads, and electromagnetic radiation, along with inefficiencies in heat transfer, manufacturing costs, and operational reliability, particularly in portable applications.
Innovation Solution
A portable SPI device with a sealed conductive non-magnetic casing, incorporating a logic board, communication boards with secondary coils of a planar transformer, and magnetic cores, which are electrically isolated from the casing and base, allowing for improved electromagnetic shielding and efficient energy transfer, along with the use of dielectric materials for heat management and stiffener ribs for mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealed protective casing is used to protect electronic components, then resistance to environmental impacts is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent employs a sealed protective casing that acts as a barrier against environmental factors while incorporating thermal management mechanisms. The casing provides protection against moisture, dust, and other environmental contaminants, while heat is dissipated through controlled thermal pathways designed into the casing structure, resolving the contradiction between sealing and heat dissipation.
2Ease of operation
If communication coils are electrically connected to the base, then electrical connectivity is improved, but resistance to electromagnetic radiation deteriorates
Solution Approach 1:
The patent introduces an intermediate layer or structure between the communication coils and the base that provides electrical connectivity while blocking electromagnetic radiation. This intermediary element allows signals to pass through while preventing harmful electromagnetic interference from affecting the base and other components, thus resolving the contradiction between connectivity and electromagnetic shielding.
3Adaptability or versatility
If multiple layers and components are stacked to increase functionality, then device capabilities are improved, but manufacturing complexity deteriorates
Solution Approach 1:
The patent divides the device into multiple functional layers or modules that can be manufactured separately and then assembled. Each layer performs a specific function (e.g., communication, processing, storage), allowing for specialized manufacturing of each component and simplifying the overall production process while maintaining high device capabilities through the integration of multiple functional segments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the device's applicability, reliability, and performance by increasing resistance to environmental factors, improving operating speed, and reducing metal consumption, while enabling efficient data and power transmission over a wide frequency range, thus expanding its use in various data technologies and telecommunications systems.
Implementation Method 1
communication coils being secondary coils of a planar transformer formed when the device for storing and processing information is installed into a device for reading/writing
Implementation Method 2
one magnetic core produced from thin-layer magnetic conducting material, provided between a base and a communication board, and/or between a logic board and a communication board
Implementation Method 3
conductive elements of the communication board switching systems are electrically isolated from the protective casing, magnetic core, base
Data Source
AI summary
The invention relates to a device for storing and processing information (SPI device) comprising a sealed protective casing produced from conductive non-magnetic material, and a unit for storing and processing information, the unit comprising a base, a logic board, communication boards, magnetic cores and electrical coupling components which are combined into an electrical circuit of the stand-alone unit for storing and processing information, and can be used in the field of radio electronics, computation, informatics, and telecommunications as a portable integrated solid-state device which is provided with a contactless input of electrical energy and information signals from another electrical energy apparatus. An achieved technical result is in wider applicability of the SPI device, increased protection of information, and improved characteristics, such as resistance to environmental impacts, higher operating speed, reliability, and multifunctional performance, improvement of mass-dimensional properties and production processability index.