Sealed Squeegee Pumping Pad for Uniform Solder Paste Density
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Solution Overview
Problem
Conventional solder paste supply devices face issues with uniform density distribution, leading to printing defects, waste, and difficulty in cleaning, due to complex configurations and local pressure application, which results in uneven solder paste discharge and mixing of different types of solder pastes.
Innovation Solution
A sealed squeegee with an integrated pressure buffer adjusting chamber and pressurization device into a single pumping pad, allowing for uniform mixing and discharge of solder paste through expansion and contraction with compressed air, simplifying components and improving sealing and cleanability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple chambers and pressing rods are used to supply solder paste, then the amount of solder paste supplied can be increased, but the density uniformity of the supplied solder paste deteriorates due to irregular pressure changes
Solution Approach 1:
The pressurization device is divided into multiple pressurization rods that can independently apply pressure to different regions of the solder paste within the single chamber, enabling both increased quantity supply and uniform density maintenance through coordinated multi-point pressurization
Solution Approach 2:
Multiple pressurization functions are merged into a single integrated pressurization device that coordinates multiple pressurization rods to work simultaneously on the same solder paste volume, combining the advantages of multiple chambers while avoiding the pressure irregularity problems
2Productivity
If a complex multi-component configuration is used for pressurization and buffering, then the solder paste supply capability is improved, but the device complexity increases and cleanability deteriorates
Solution Approach 1:
The pressurization device and pressure buffer device are merged into a single integrated component structure where the pressurization rod assembly inherently provides both pressurization and pressure buffering functions, eliminating the need for separate buffer chambers and reducing overall device complexity
Solution Approach 2:
The pressurization device is designed to perform multiple functions simultaneously - pressurization, pressure buffering, and sealing - through its integrated structure, allowing a single component to replace what would traditionally require multiple separate components
3Ease of operation
If local pressure application is used in the pressurization chamber, then the solder paste can be discharged, but the mixing uniformity of solder paste deteriorates and dead zones are formed
Solution Approach 1:
The pressurization rod is designed with varying cross-sectional areas along its length, creating different local pressure zones that work together to eliminate dead zones while maintaining uniform mixing, with each local region contributing differently to the overall pressurization effect
4Reliability
If multiple separate components are used for pressurization and buffering, then the functions are specialized, but the sealing performance deteriorates and cleaning becomes difficult
Solution Approach 1:
The pressurization and buffering functions are combined into a single integrated device with continuous sealing surfaces, eliminating the sealing interfaces between separate components while maintaining functional specialization through the multi-functional design of the integrated structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform solder paste density, reduces waste and defects, and facilitates easy cleaning and assembly, maintaining consistent pressure for improved printing quality and reduced raw material waste.
Implementation Method 1
repeatedly expands and contracts into the pressurization chamber communicating with the pumping through hole by compressed air supplied and discharged through a plurality of air injection holes to perform pumping
Data Source
AI summary
A sealed squeegee for supplying a solder paste with a uniform density is disclosed. In the process of pressurizing and mixing the solder paste contained in a pressurization chamber by a pumping pad that contracts and expands according to injection and discharge of compressed air, the sealed squeegee minimizes a pressure change within the pressurization chamber due to a pressure shock within the pressurization chamber, reduces the number of components by coupling separate components of the existing buffer device and pressurization device into a single pumping pad, prevents a pressure drop within the pressurization chamber by improving sealing capability, prevents unnecessary waste of the solder paste through ease of disassembly and assembly by reducing the number of components and precision in discharging the appropriate amount of solder paste, and improves printing quality by improving Maycleanability for using different types of solder pastes.