Sealed Sub-Module Layout for Dense Electronic Component Mounting
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Solution Overview
Problem
Existing electronic component modules face challenges in achieving high-density component mounting due to size constraints, electromagnetic interference, and limitations in heat dissipation and withstand voltage properties.
Innovation Solution
The proposed solution involves an electronic component module configuration that includes a substrate with mounted electronic components and a sub-module. The sub-module features a wiring board with electronic components stacked on both sides, covered by a sealing member, which enhances component density and addresses electromagnetic interference and heat dissipation issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple electronic components are mounted on a substrate in a conventional module structure, then the module can perform multiple functions, but the component mounting density is low and the module size is large
Solution Approach 1:
The patent applies nesting by placing a sub-module (containing multiple electronic components mounted on both front and back surfaces) onto the main module substrate. This nested configuration allows multiple components to occupy a compact three-dimensional space rather than spreading out in two dimensions, thereby increasing component mounting density while reducing the overall module footprint.
Solution Approach 2:
The patent transitions from conventional two-dimensional component mounting on a single substrate surface to three-dimensional mounting by utilizing both front and back surfaces of a sub-module. This dimensional change enables components to be stacked vertically rather than arranged horizontally, significantly increasing mounting density within a smaller area.
2Object-affected harmful factors
If electromagnetic shields are installed around each component to prevent radio wave interference, then electromagnetic shielding properties improve, but the module size increases and manufacturing becomes more complex
Solution Approach 1:
The patent merges the electromagnetic shielding function into the sub-module structure itself rather than implementing separate shields around each component. The sub-module housing integrates shielding capabilities while containing multiple components, simplifying the overall structure and reducing manufacturing complexity compared to individual component shielding.
Solution Approach 2:
The sub-module structure serves multiple functions simultaneously: it provides mechanical support for mounting components on both surfaces, offers electromagnetic shielding protection, and enables compact three-dimensional integration. This multi-functionality eliminates the need for separate dedicated shielding structures for each component.
3Temperature
If the surface size of electronic components is increased to improve heat dissipation and withstand voltage properties, then thermal and electrical performance improve, but component mounting density decreases
Solution Approach 1:
The patent addresses heat dissipation by utilizing three-dimensional space for thermal management structures rather than increasing component surface area. Heat dissipation pathways are implemented vertically through the sub-module structure, allowing components to maintain smaller footprints while achieving adequate thermal performance through optimized heat conduction paths in the third dimension.
Data Source
AI summary
The present disclosure is directed to an electronic component module including: a substrate; an electronic component mounted on the substrate; and a sub-module mounted on the substrate, the sub-module including a wiring board, a first electronic component disposed on one of two main surfaces of the wiring board, a second electronic component disposed on the other of the two main surfaces of the wiring board, and a first sealing member that covers the wiring board, the first electronic component, and the second electronic component.