Sealed Switching Board Structure for High-Pressure Vapor Leakage Control

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Solution Overview

Problem

Conventional switching boards in two-phase immersion cooling positive high pressure sealed tanks face issues with high pressure water cooling vapor leakage and structural integrity due to signal line outlets, and existing solutions like vacuum inlet terminals are expensive and inconvenient to replace.

Innovation Solution

A switching board design with a circuit board and metal elements, including a first metal ring and second metal rings, soldered to the board, which surrounds switching elements and vias, providing a sealed structure that supports both sides of the circuit board, and a soldering method using multiple baking steps to secure the metal elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If signal lines are externally connected through the sealed tank, then signal transmission function is improved, but water cooling liquid leakage increases

Engineering Contradiction:
Improvesignal transmission functionVSAvoidwater cooling liquid leakage
Core Design Contradiction:
Adaptability or versatilityVSLoss of substance

Solution Approach 1:

The patent introduces a sealing ring as an intermediary component between the signal line outlet and the sealed tank interior. This sealing ring acts as a mediator that allows signal lines to pass through while preventing water cooling liquid leakage, thus resolving the contradiction between signal transmission functionality and leakage prevention.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If conventional switching board is used in sealed tank, then signal line connection is simplified, but pressure resistance deteriorates

Engineering Contradiction:
Improvesignal line connection complexityVSAvoidpressure resistance
Core Design Contradiction:
Device complexityVSStrength

Solution Approach 1:

The patent employs a composite structure combining a circuit board with metal reinforcement rings (first metal ring and second metal rings). This composite design integrates the electrical functionality of the circuit board with the mechanical strength of metal components, enabling the switching board to withstand high pressure while maintaining signal connection capabilities.

Inventive Principle:
Principle #40Composite materials

3Reliability

If vacuum inlet terminals are used to reduce leakage, then sealing performance is improved, but cost and replaceability deteriorate

Engineering Contradiction:
Improvesealing performanceVSAvoidcost and replaceability
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent adopts a sealing ring that can be easily replaced, functioning as a disposable or temporary component. This sealing ring provides effective sealing at lower cost compared to vacuum inlet terminals, and can be replaced when worn or damaged, thus improving ease of manufacture and maintenance while maintaining reliable sealing performance.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

4Adaptability or versatility

If more signal line outlets are provided, then adaptability is improved, but leakage rate increases

Engineering Contradiction:
Improvesignal line connection adaptabilityVSAvoidleakage rate
Core Design Contradiction:
Adaptability or versatilityVSLoss of substance

Solution Approach 1:

The patent divides the sealing function into multiple segments by providing multiple sealing rings corresponding to different signal line outlets. Each sealing ring independently seals its associated outlet, allowing multiple signal lines to be connected while maintaining effective sealing at each interface, thus preventing leakage from increasing with the number of outlets.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances pressure resistance, reduces vapor leakage, and maintains structural integrity while allowing for replaceable modules, with a low fabrication cost and minimal vapor leakage under high pressure.

Implementation Method 1

the first metal element is fastened to the first metal ring and the plurality of second metal rings by a soldering process using a solder paste and a baking process using a baking unit

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentUS12426196B2Switching board and soldering method thereof
Publication Date: 2025.09.23 AEWIN TECH CO LTD
  • US12426196B2 patent drawing
  • US12426196B2 patent drawing
  • US12426196B2 patent drawing

AI summary

A switching board and a soldering method thereof are provided. The switching board includes a circuit board having a board body and a first metal ring, where the board body has a first surface, and the first metal ring is formed on the first surface and surrounds a periphery of the board body. The switching board further includes a first metal element disposed on the first surface and fastened to the first metal ring by soldering. The switching board has a high pressure resistance and a low leakage rate.