Semiconductor Device Testing With Sealed Vacuum Contact Force
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Solution Overview
Problem
Current semiconductor device testing systems face issues with mechanical power systems that are space-consuming, costly, and energy-intensive, and vacuum-based systems suffer from vacuum leakage due to wear and tear, leading to inconsistent electrical contact.
Innovation Solution
A test system that applies force using a sealed auxiliary chamber with a vacuum mechanism, eliminating the need for mechanical power and preventing vacuum leakage by using sealing devices to ensure consistent electrical contact between semiconductor devices and test sockets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mechanical power system is used to apply force to the abutting apparatus, then electrical contact between semiconductor devices and test sockets is achieved, but the system becomes space-consuming, costly, and energy-intensive
Solution Approach 1:
The patent replaces the mechanical power system with a vacuum-based system. Instead of using motors or mechanical actuators to apply downward force on the abutting apparatus, the system creates a vacuum in the test chamber that causes the abutting apparatus to be pulled down through atmospheric pressure, achieving the same electrical contact function without complex mechanical components
Solution Approach 2:
The patent uses vacuum (a pneumatic principle) to apply force to the abutting apparatus. By creating a pressure difference between the inside of the test chamber and the outside atmosphere, the system generates the necessary downward force on the abutting apparatus and test sockets to ensure reliable electrical contact
2Device complexity
If vacuum technology is used to apply pressure to the abutting apparatus, then mechanical power systems are eliminated, but vacuum leakage occurs due to wear and tear of sealing devices
Solution Approach 1:
The patent incorporates sealing devices between the test chamber cover and seat that are designed to accommodate wear and maintain vacuum integrity. The sealing mechanism includes features that compensate for wear over time, such as replaceable seal elements or self-adjusting sealing surfaces, ensuring long-term vacuum reliability without compromising the elimination of mechanical power systems
Solution Approach 2:
The patent optimizes the vacuum pressure parameters and sealing surface characteristics to minimize wear. By controlling the vacuum level and designing the sealing interface with appropriate material properties and geometric features, the system achieves reliable vacuum sealing that withstands repeated use without significant degradation
3Manufacturing precision
If horizontal holes are used to limit compression force of the abutting apparatus, then positioning is improved, but flatness and pressure cushioning are limited
Solution Approach 1:
The patent employs multiple abutting apparatuses with different local characteristics. Each abutting apparatus is designed with specific local properties (such as varying contact surface areas, materials, or geometric features) that allow them to compensate for positioning variations and maintain uniform pressure distribution across the test sockets, thereby achieving both precise positioning and good contact flatness
4Manufacturing precision
If pins of different lengths are used in the abutting apparatus to adjust compression force, then positioning is improved, but the structure becomes very complex and pins are difficult to replace
Solution Approach 1:
The patent divides the abutting apparatus into modular segments or components that can be independently adjusted or replaced. Instead of using fixed pins of different lengths, the system employs modular positioning elements or adjustable mechanisms that allow easy reconfiguration and replacement of individual components, simplifying maintenance while maintaining positioning accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides reliable and efficient electrical contact without mechanical power systems, reducing space, cost, and energy consumption while maintaining consistent contact quality over time.
Implementation Method 1
The auxiliary chamber is extracted, so that a pressure difference is formed to actuate the cover toward the seat and further to apply a force to the abutting apparatus
Data Source
AI summary
A test system, for testing a plurality of semiconductor devices, includes a carrying apparatus, an abutting apparatus and a pressing apparatus including a cover and a seat. The cover and the seat constitute a test chamber and a sealed auxiliary chamber. The carrying apparatus is disposed within the test chamber. Each semiconductor device is carried by one of a plurality of test sockets of the carrying apparatus. The abutting apparatus is disposed between the cover and the test sockets. The auxiliary chamber is extracted through at least one extraction hole, such that an air pressure in the auxiliary chamber is lowered to actuate the cover toward the seat and further to apply force to the abutting apparatus, and such that the abutting apparatus presses against the test sockets and the semiconductor devices to allow each test socket to electrically contact with the semiconductor device carried by said one test socket.