Sealed Enclosure for Wire Bonded Sensors in High Temperature Environments
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Solution Overview
Problem
Existing sensor technologies face reliability issues when used in high temperature and corrosive environments due to inadequate packaging and interconnection materials, particularly with wire bonding technology.
Innovation Solution
The development of a sensor device with a sealed enclosure that isolates wire bonded interconnections and contact pads from the external environment, using high temperature electrical isolators and inert materials to prevent corrosion and extend the lifespan of metal components at elevated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire bonding technology is used for electrical interconnections, then ease of manufacture is improved, but reliability deteriorates in high temperature corrosive environments
Solution Approach 1:
The patent divides the sensor device into two distinct environments: a sealed inert environment containing the wire bonds and electrical interconnections, and an external harsh environment. This segmentation isolates the vulnerable wire bonds from corrosive media while maintaining the manufacturing advantages of wire bonding technology.
Solution Approach 2:
The patent creates a sealed inert environment using hermetic sealing techniques to enclose the wire bonded interconnections and electrical contacts. This inert atmosphere prevents oxidation and corrosion of the metal components, enabling reliable operation at temperatures above 600°C while maintaining ease of manufacture through wire bonding.
2Reliability
If leadless semiconductor sensor chip with pins is used, then reliability is improved in high temperature environments, but device complexity increases
Solution Approach 1:
The patent introduces a sealed inert environment as an intermediary between the sensor chip and the external harsh environment. This mediator protects the electrical interconnections without requiring complex thermal expansion matching or specialized high-temperature contact materials, thus maintaining reliability while reducing overall device complexity.
3Ease of operation
If sensor components are exposed to external environment, then ease of operation is improved, but reliability deteriorates due to corrosion and oxidation
Solution Approach 1:
The patent segments the sensor device into protected and exposed portions. The electrical interconnections and contact pads are enclosed in a sealed inert environment, while only the sensing element remains exposed to the external environment for operational access. This segmentation maintains ease of operation while preventing corrosion of critical electrical components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable operation of sensors in high temperature environments above 600°C by reducing interdiffusion of metals and protecting against corrosive media, enhancing the reliability and longevity of sensor devices.
Implementation Method 1
a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured to isolate at least the one or more wire bonded interconnections and the one or more contact pads from an external environment
Data Source
AI summary
Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.