Sealing Compound Applicator with Variable Annular Gap
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Solution Overview
Problem
Existing methods for applying sealing compounds to closure caps face issues such as imprecise portioning, non-uniform ring shapes, and the risk of adhesion or pulling threads due to temperature differences, particularly with hot sealants sticking to non-cold surfaces.
Innovation Solution
A method involving a temperature-controlled annular gap with a variable width, where the gap width is rapidly reduced to zero to press out the sealing compound, ensuring high exit speed and preventing adhesion, using an applicator with cylindrical stamps and a non-return valve to maintain clean termination and prevent backflow, and a cold ring-shaped pressing tool to form a uniform sealing ring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the sealing compound is applied using conventional methods with hot sealants, then the sealing compound can be effectively discharged, but adhesion or pulling threads occur on the outer surfaces of the applicator due to temperature differences
Solution Approach 1:
The patent applies parameter changes by rapidly reducing the gap width between the annular gap walls from an initial width to zero, transforming the sealing compound from a stationary state to a high-velocity extruded state. This rapid parameter change ensures the sealant exits at sufficient speed to prevent adhesion on the outer surfaces of the applicator
Solution Approach 2:
The patent implements preliminary anti-action by pre-cooling the outer surfaces of the applicator before the sealing compound is discharged. This preliminary cooling creates a temperature difference that prevents the hot sealant from adhering to the applicator surfaces during the discharge process
2Reliability
If the gap width is rapidly reduced to zero to prevent adhesion, then adhesion is prevented, but the manufacturing precision and uniformity of the sealing ring may be compromised
Solution Approach 1:
The patent applies dynamics by using a variable gap width that changes during the discharge process. The gap width is initially set to allow proper filling, then rapidly reduced to zero at the appropriate moment. This dynamic adjustment ensures both uniform ring shape formation and prevention of adhesion on outer surfaces
Solution Approach 2:
The patent implements feedback control by monitoring the discharge process and adjusting the gap width reduction timing based on the extrusion speed and flow characteristics of the sealing compound. This feedback mechanism ensures the gap closes at the optimal moment to maintain uniformity while preventing adhesion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents adhesion and pulling threads, ensuring a clean, uniform application of the sealing compound without deformation, achieving a reliable and precise sealing process.
Implementation Method 1
the plasticized sealing compound is pressed completely out of the annular gap by rapidly reducing the gap width to zero
Implementation Method 2
the initial speed is sufficiently high that partial adhesions do not occur at the exit edges of the annular gap
Data Source
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AI summary
Disclosed is a method for applying a sealing compound to a surface, in which an annular structure (30) is formed from plasticized sealing compound and is then applied to the surface. Said method is characterized in that the plasticized sealing compound is annularly introduced into a temperature-controlled annular gap (26) having a variable width, the entire sealing compound is pressed out of the annular gap (26) and is shaped into the annular structure by quickly reducing the gap width to zero, and the sealing compound is deposited on the surface.