Sealing Bead Openwork Patterns for Cavity Control
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Solution Overview
Problem
Existing methods for encapsulating micro-systems, such as MEMS, fail to effectively control the deformation of sealing beads during bonding, leading to potential overflow onto active zones and compromised device functionality due to unoptimized surface design and mechanical strength.
Innovation Solution
Incorporating openwork patterns with perpendicular empty zones into the sealing bead before crushing, allowing for controlled deformation and improved adhesion between substrates, thereby ensuring precise cavity dimensions and enhanced mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a continuous sealing bead is used, then the sealing is complete and continuous, but the deformation during crushing is difficult to control and may overflow onto active zones
Solution Approach 1:
The sealing bead is segmented into an openwork pattern with empty zones distributed throughout its structure. This segmentation allows the bead to deform in a controlled manner during crushing while maintaining sealing integrity, preventing overflow onto active zones by providing designated compression zones that absorb deformation.
2Strength
If the sealing bead height is increased to ensure complete sealing, then the sealing strength is improved, but the cavity height control becomes less precise
Solution Approach 1:
The openwork pattern creates local variations in the sealing bead structure, with empty zones strategically positioned to control deformation behavior. This allows different regions of the bead to have different mechanical properties, enabling complete sealing through increased effective height while maintaining precise cavity height control through localized compression zones.
3Strength
If a solid sealing bead is used, then the mechanical strength is high, but the active surface area is reduced due to larger bead dimensions
Solution Approach 1:
The sealing bead employs an openwork porous structure with empty zones distributed throughout. This porous design maintains mechanical strength through the distributed framework while significantly reducing the material volume and footprint of the bead, thereby preserving more active surface area on the chip for device functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables better control over the sealing bead's deformation and final dimensions, ensuring the integrity of the cavity and the active surface, thus protecting the micro-systems from external attacks while maintaining proper device functionality.
Implementation Method 1
bonded to each other by crushing a closed peripheral sealing bead
Implementation Method 2
bonding a cover to a substrate with a bead of resin
Data Source
Figure 1~3
Figure 4~7
AI summary
The structure comprises facing substrates bonded to each other by crushing a closed peripheral sealing bead (3), delimiting, between the substrates, a closed cavity in which a microsystem is disposed. The sealing bead (3) has, before crushing, openwork patterns (5) delimiting, within the bead (3), a plurality of void zones (6).