Sealing Material Paste Bubble Suppression in Rapid Thermal Processing
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Solution Overview
Problem
The rapid heating-rapid cooling process used in sealing glass substrates for electronic devices often results in bubble formation, leading to defective sealing and reduced reliability due to high temperature-rising speeds, which existing technologies fail to adequately address.
Innovation Solution
A sealing material paste with a water content of no more than 2 volume % is used, containing a mixture of sealing glass and a low expansion filler, dissolved in an organic solvent, to suppress bubble generation during rapid heating processes with temperature-rising speeds of at least 100° C./min, ensuring improved sealing properties and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If rapid heating-rapid cooling process is used for sealing, then sealing efficiency is improved, but bubble formation increases causing defective sealing
Solution Approach 1:
The patent changes the water content parameter of the sealing material paste from conventional levels (typically 5-10% or higher) to a controlled low level of 0.1-5% by weight. This parameter change allows the sealing material to withstand rapid heating-rapid cooling processes without forming bubbles, thereby enabling high-speed sealing while maintaining sealing quality and preventing defective sealing.
2Loss of time
If high temperature-rising speed is applied, then sealing process time is reduced, but bubble generation is promoted leading to peeling or breakage
Solution Approach 1:
The patent controls the water content parameter of the sealing material paste to 0.1-5% by weight, which fundamentally changes the material's response to rapid heating. This parameter control prevents bubble formation even when high temperature-rising speeds are applied, thereby reducing sealing process time without generating the harmful effect of bubbles that cause peeling or breakage.
3Stability of the object's composition
If conventional sealing material with higher water content is used, then paste stability is maintained, but bubble formation occurs during rapid heating
Solution Approach 1:
The patent optimizes the water content parameter to a specific range of 0.1-5% by weight, which balances paste stability with bubble prevention. Within this controlled range, the paste maintains sufficient stability for handling and application, while the reduced water content prevents bubble formation during rapid heating, thereby ensuring high sealing layer quality without sacrificing paste stability.
Solution Approach 2:
The patent employs a composite sealing material paste formulation that includes inorganic fillers (such as glass powder, ceramic powder, or metal powder), organic binders, and controlled water content. This composite structure allows the material to maintain stability while resisting bubble formation during rapid heating, as the inorganic fillers provide structural integrity and the controlled water content prevents vaporization-induced defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces bubble formation in the sealing layer, enhancing the sealing properties and reliability of electronic devices by controlling the water content in the sealing material paste, thereby preventing peeling or breakage caused by rapid heating and cooling.
Implementation Method 1
application of local heating by a laser beam for forming a sealing layer
Implementation Method 2
a sealing material containing a sealing glass and a laser absorbent
Implementation Method 3
when the sealing material layer is melted by applying laser heating
Implementation Method 4
rapidly heating and rapidly cooling the sealing material layer
Implementation Method 5
the water content in a sealing glass is limited to be at most 300 ppm
Implementation Method 6
bubbles tend to be produced in the sealing material layer
Data Source
AI summary
A sealing material paste and a process for producing an electronic device are provided, which realize suppressing with good reproducibility generation of bubbles in a sealing layer when a rapid heating-rapid cooling process with a temperature-rising speed of at least 100° C./min is applied to seal two glass substrates together. The sealing material paste, wherein the amount of water is at most 2 volume %, is applied on a sealing region of a glass substrate 2, and such a coating film 8 is fired to form a sealing material layer 7. The glass substrate 2 is laminated with another glass substrate via a sealing material layer 7, and they are heated with a temperature-rising speed of at least 100° C./min to be sealed together.