Sealing Resin Crosslink Density and Water Vapor Barrier
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Solution Overview
Problem
Conventional sealing resins for electronic devices, particularly organic light-emitting diode elements, suffer from low crosslink density and inadequate water vapor barrier properties, leading to reduced shear adhesive strength and poor sealing durability due to moisture penetration.
Innovation Solution
A crosslinkable organometallic desiccant with a specific metal complex compound, such as M(OR)x, is incorporated into the resin composition, enhancing crosslink density and water vapor barrier properties while suppressing the lowering of shear adhesive strength upon humidification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a moisture-reactive organometallic desiccant is added into the sealing resin, then the water vapor barrier property is improved, but the shear adhesive strength is lowered due to alcohol segregation at the interface
Solution Approach 1:
A compatibility promoter (surfactant) is introduced as an intermediary substance between the organometallic desiccant and the sealing resin. This mediator prevents alcohol segregation at the interface by improving compatibility between the desiccant and resin matrix, thereby maintaining both water vapor barrier properties and shear adhesive strength after humidification testing
2Strength
If the degree of cross-linkage of the sealant is made low to suppress alcohol segregation, then the shear adhesive strength is maintained, but the water vapor barrier property becomes insufficient
Solution Approach 1:
The patent optimizes the crosslinking degree parameter to a specific range (5-50%) rather than using extreme values. This intermediate crosslinking level, combined with the compatibility promoter, achieves a balance where both adequate water vapor barrier properties and sufficient shear adhesive strength are obtained simultaneously
3Stability of the object's composition
If a non-crosslinked material or monoacrylate is used to reduce crosslink density, then the material compatibility is improved, but the water vapor barrier property is far from satisfactory
Solution Approach 1:
The patent creates a composite sealing resin system comprising multiple components: base resin, organometallic desiccant, compatibility promoter, and crosslinking agent. This composite formulation achieves both material compatibility and high water vapor barrier properties through synergistic interactions among the components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a sealing resin with improved crosslink density and water vapor barrier properties, extending the sealing lifetime and ensuring excellent sealing durability and performance.
Implementation Method 1
a crosslinkable organometallic desiccant composed of a ligand having a crosslinkable group
Implementation Method 2
it has been found that such peeling is caused by significant lowering of shear adhesive strength of a sealing material after the humidification testing
Data Source
AI summary
An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand:M(ORx)n Formula (1)wherein, in formula (1), M designates Al, B, Ti or Zr; Rx in the ligand designates an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by formula (a); at least one of Rx's has a crosslinkable group; and n designates a valence of M.wherein, in formula (a), O* designates O of ORx in formula (1); R1 designates an alkyl group, an alkenyl group or an acyl group; R2 designates a hydrogen atom or an alkyl group; and R3 designates an alkyl group or an alkoxy group.