Sealing Resin Composition for Bleed-Free Underfill Injection
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Solution Overview
Problem
The reduction in surface tension caused by the addition of siloxane copolymers or silicone compounds in liquid resin compositions for underfill materials leads to deterioration in package injection performance, necessitating a solution that suppresses bleeding without using these materials.
Innovation Solution
A sealing resin composition comprising an epoxy resin, a curing agent with at least one amino group, and an inorganic filler with specific particle size and surface area characteristics, including a combination of first and second inorganic fillers, which maintains viscosity and fluidity to prevent bleeding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If siloxane copolymers or silicone compounds are added to liquid resin composition to suppress bleeding, then bleeding is suppressed, but surface tension is reduced leading to deterioration in package injection performance
Solution Approach 1:
The invention extracts and eliminates the harmful component (siloxane copolymers and silicone compounds) from the resin composition while maintaining the desired bleeding suppression effect through alternative means - specifically by using epoxy resin with amino group-containing curing agents and controlled inorganic filler combinations, thus avoiding surface tension reduction
Solution Approach 2:
The invention changes the chemical composition parameters by specifying epoxy resin (A) with particular epoxy equivalents (80-250 g/eq) and amino group-containing curing agents (B), along with controlled inorganic filler content (30-80 mass%), to achieve bleeding suppression through molecular structure control rather than surface tension modification
2Reliability
If viscosity of liquid resin composition is reduced to improve injection performance, then package injection performance is improved, but bleeding may occur
Solution Approach 1:
The invention optimizes the viscosity parameter by controlling the molecular weight and structure of epoxy resin (epoxy equivalents 80-250 g/eq) and the type and amount of inorganic filler (30-80 mass%), achieving a balanced viscosity that enables proper injection performance while preventing bleeding through appropriate fluidity control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed composition effectively suppresses bleeding and maintains optimal viscosity and fluidity, enhancing the reliability of electronic component devices by preventing contamination and ensuring proper sealing.
Implementation Method 1
a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 m2/g or more
Implementation Method 2
an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule
Data Source
AI summary
A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 m2/g or more.