Sealing Retainer for Electronic Module Cooling Gas Passageways
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Solution Overview
Problem
State-of-the-art electronic assemblies using the VITA 48.8 AFT standard face complexity and gasket binding issues due to precision tapers and gasket requirements, which can be compromised during module insertion and extraction, affecting thermal management and reliability.
Innovation Solution
An electronic assembly design featuring a chassis with cooling gas passageways and a sealing retainer system that includes a retainer body and a gas seal body, movable between retracted and extended positions, to facilitate module insertion and sealing, eliminating the need for precision tapers and gasket compression, with a rotational drive member to manage the gas seal body's position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If precision tapers and gasket compression are used to seal cooling gas passageways, then thermal management performance is improved, but device complexity and reliability deteriorate due to binding issues during module insertion and extraction
Solution Approach 1:
The sealing mechanism transitions from a static compressed gasket to a dynamic system where the gas seal body moves between retracted and extended positions. During insertion, the seal body is retracted to allow module access; during operation, it extends to create the seal, adapting the sealing state to the operational phase
Solution Approach 2:
The sealing function is divided into two independent components: the gas seal body that creates the seal and the sealing gasket that provides the sealing surface. This segmentation allows the gas seal body to move independently without being constrained by gasket compression requirements, eliminating the binding issue while maintaining sealing effectiveness
2Manufacturing precision
If precision tapers are used on plug-in electronic modules, then sealing accuracy is improved, but manufacturing precision and device complexity worsen
Solution Approach 1:
Instead of relying on precision tapers for sealing alignment, the system uses a movable gas seal body that can extend to engage with the module's flat surface. This dynamic approach achieves sealing accuracy through controlled movement rather than precision geometry, simplifying manufacturing requirements
Solution Approach 2:
The gas seal body acts as an intermediary between the chassis and the module, providing the sealing function without requiring precision tapers on either component. The seal body's movement and engagement mechanism mediates the connection, achieving accurate sealing through its design rather than through precision-matched mating surfaces
3Temperature
If gaskets are compressed to seal cooling passageways, then thermal management is improved, but ease of operation worsens due to binding during insertion and extraction
Solution Approach 1:
The sealing system dynamically adapts to operational requirements: the gas seal body retracts during insertion/extraction operations to eliminate binding, then extends during normal operation to provide the necessary seal. This dynamic behavior resolves the conflict between sealing effectiveness and ease of operation
Solution Approach 2:
The gas seal body is retracted in advance before module insertion occurs, preparing the sealing mechanism to accommodate easy module access. After insertion is complete, the seal body extends to establish the seal, ensuring both ease of operation and thermal management performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal management by maintaining airflow integrity without gasket wear, allowing for easy module insertion and removal, and reduces thermal resistance, improving the reliability and efficiency of cooling systems in electronic assemblies.
Implementation Method 1
the gas seal body in the extended position may seal against the electronic module
Implementation Method 2
The VITA 48.8 AFT standard is directed to channeling airflow through plug-in module heat sinks that interface with a pressurized airflow manifold
Implementation Method 3
interface with a pressurized airflow manifold to reduce thermal resistances between the cooling medium and the heat-generating electronic components
Data Source
AI summary
An electronic assembly may include a chassis having electronic module mounting positions, each having a chassis cooling gas passageway and an electronic module received in each electronic module mounting position. A sealing retainer may be coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with the chassis cooling gas passageway and a module cooling gas passageway of a respective electronic module. The sealing retainer may include a retainer body, and a gas seal body coupled to the retainer body and movable between retracted and extended positions. The gas seal body in the retracted position permits insertion and removal of the electronic module, and in the extended position seals against the electronic module.