Sealing Ring Assembly for Thermal O-Ring Deformation
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in effectively sealing spaces between chamber members to prevent leakage and maintain process efficiency, particularly during the use of gases and fluids.
Innovation Solution
A sealing ring assembly comprising an O-ring, a first guide ring, and a second guide ring, where the guide rings have progressively increasing thicknesses away from the central axis, and a sealing groove with varying depth, to accommodate thermal deformation of the O-ring, ensuring effective sealing in varying temperature environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional O-ring sealing structure is used, then the structure is simple, but the sealing effectiveness deteriorates under thermal deformation conditions
Solution Approach 1:
The sealing structure is divided into multiple functional components: an O-ring for sealing, a first guide ring for positioning and supporting the O-ring, and a second guide ring for additional guidance. This segmentation allows each component to perform its specific function optimally, with the guide rings accommodating thermal deformation while the O-ring maintains sealing effectiveness.
Solution Approach 2:
The guide rings act as intermediary elements between the O-ring and the sealing groove. They mediate the thermal deformation effects, allowing the O-ring to expand and contract without compromising the sealing interface. The guide rings absorb the dimensional changes and transmit only the necessary positioning function to the O-ring.
2Reliability
If the sealing groove depth is uniform, then the manufacturing is simple, but the O-ring cannot accommodate thermal expansion and contraction
Solution Approach 1:
The sealing groove is designed with non-uniform depth, creating different local qualities within the same structure. The groove is deeper in certain regions to accommodate O-ring expansion during thermal cycles, while maintaining adequate depth elsewhere for proper sealing. This localized variation in geometry allows the O-ring to undergo thermal deformation within the groove boundaries without compromising the seal.
3Reliability
If the guide rings have uniform thickness, then the manufacturing is easier, but they cannot effectively guide the O-ring during thermal cycles
Solution Approach 1:
The guide rings are designed with non-uniform thickness distributions, creating different local properties to optimize their guiding function. The varying thickness allows certain regions to be more compliant for accommodating O-ring movement during thermal cycles, while other regions provide stronger positioning. This localized variation in thickness enhances the guiding effectiveness without requiring complex assembly procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sealing ring assembly effectively seals spaces between chamber members, preventing leakage and enhancing process efficiency by accommodating thermal expansion and contraction of the O-ring, thereby maintaining process integrity and safety.
Implementation Method 1
accommodate thermal deformation of the O-ring
Implementation Method 2
accommodate thermal expansion and contraction of the O-ring
Data Source
AI summary
A substrate processing apparatus includes an O-ring defined by a central axis, a first guide ring located closer to the central axis than is the O-ring, and a second guide ring located further from the central axis than is the O-ring. A thickness of each of the first guide ring and the second guide ring becomes progressively greater further from the central axis.