Thermosetting Sealing Sheet for Circuit Members With Hollow Spaces
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Solution Overview
Problem
Existing sealing methods for circuit members on a circuit board struggle to collectively seal components with varying intervals and heights while maintaining internal spaces, as the behavior of the sealing sheet is influenced by the length and variability of these intervals and heights.
Innovation Solution
A manufacturing method involving a sheet with thermosetting properties, comprising a resin composition with specific viscoelastic properties, is used to seal circuit members with different separation distances and heights, ensuring the sheet enters gaps between components without entering internal spaces, utilizing a layered structure with controlled loss tangent and storage shear modulus to facilitate sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a sheet is used to seal circuit members with different separation distances, then sealing of multiple components is achieved, but the sheet may enter internal spaces of some components due to varying entry speeds
Solution Approach 1:
The patent changes the physical parameters of the sealing sheet by controlling its viscoelastic properties. Specifically, it sets the loss tangent tan δ between 0.1 and 0.8 and storage shear modulus between 1×10^4 Pa and 1×10^7 Pa at sealing temperature. These parameter adjustments enable the sheet to have optimal entry speed characteristics that allow it to fill gaps between circuit members with different separation distances while preventing entry into internal spaces, thus resolving the contradiction between collective sealing efficiency and internal space maintenance.
Solution Approach 2:
The patent applies local quality by creating different entry speeds in different regions of the sealing sheet. The sheet's viscoelastic properties are controlled so that it exhibits appropriate flow behavior locally - entering gaps between circuit members while maintaining enough rigidity to avoid entering internal spaces. This localized control of material behavior allows simultaneous sealing of multiple components with varying intervals without compromising internal spaces.
2Manufacturing precision
If the sheet enters gaps between circuit members quickly, then sealing of narrow gaps is achieved, but the sheet may also enter internal spaces
Solution Approach 1:
The patent precisely controls the viscoelastic parameters of the sealing sheet - loss tangent tan δ (0.1-0.8) and storage shear modulus (1×10^4-1×10^7 Pa) at sealing temperature. These parameter specifications create an optimal balance where the sheet has sufficient fluidity to enter narrow gaps between circuit members for precise sealing, while maintaining enough structural integrity to prevent unwanted entry into internal spaces. The controlled parameters ensure predictable entry behavior that achieves manufacturing precision without compromising reliability.
3Ease of operation
If the sheet is made more flexible to enter narrow gaps, then gap sealing is improved, but the sheet loses ability to maintain internal spaces
Solution Approach 1:
The patent optimizes the flexibility parameter of the sealing sheet by controlling its storage shear modulus between 1×10^4 Pa and 1×10^7 Pa and loss tangent tan δ between 0.1 and 0.8 at sealing temperature. This controlled flexibility range enables the sheet to easily enter narrow gaps between circuit members for effective sealing, while simultaneously maintaining sufficient rigidity to preserve internal spaces and prevent collapse. The balanced parameter specification resolves the contradiction between ease of gap entry and internal space maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the collective sealing of circuit members with varying intervals and heights, maintaining internal spaces effectively by controlling the sheet's viscoelasticity to ensure it enters gaps between components while avoiding internal spaces, thus enhancing the reliability and efficiency of the sealing process.
Implementation Method 1
a step of preparing a sheet having thermosetting property; a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members and to cure the sheet
Implementation Method 2
the resin composition has, at a temperature t when the second circuit members are sealed, a loss tangent tan δ of 0.1 or more and 0.8 or less, and a storage shear modulus of 1×10^4 Pa or more and 1×10^7 Pa or less
Data Source
AI summary
A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a step of preparing a sheet having thermosetting property; a disposing step of disposing the sheet on the mounting member so as to face the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members and to cure the sheet, wherein the second circuit members include a reference member, and a first adjacent member and a second adjacent member each adjacent to the reference member, a separation distance D1 between the reference member and the first adjacent member is different from a separation distance D2 between the reference member and the second adjacent member, at least one of the plurality of the second circuit members is a hollow member to be provided with a space from the first circuit member, and in the sealing step, the plurality of the second circuit members are sealed so as to maintain the space.