Seamless Shielding Frame with Heat Dissipating Element
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Solution Overview
Problem
Electronic products face challenges in preventing electromagnetic interference (EMI) and heat dissipation, particularly in compact designs where components like tuners and central processing units need integrated shielding and cooling solutions.
Innovation Solution
An electromagnetic shielding device with a seamless frame and a tightly combined cover forms a closed shielding space, incorporating a heat dissipating element to block external electromagnetic waves and dissipate heat for electronic elements on a circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional segmented frame structure is used for electromagnetic shielding, then the manufacturing process is simpler, but the shielding effectiveness is reduced due to gaps and seams
Solution Approach 1:
The patent merges multiple frame segments into a single seamless one-piece structure. The frame is formed as an integrated component without joints or seams, eliminating gaps that would compromise electromagnetic shielding effectiveness while maintaining structural integrity and simplifying assembly.
Solution Approach 2:
The seamless frame structure serves multiple functions: it provides electromagnetic shielding, structural support, and thermal conduction pathways. The frame integrates these functions into a single component, reducing the need for additional separate elements and simplifying the overall device complexity.
2Reliability
If electromagnetic shielding is added to electronic products, then electromagnetic interference is prevented, but heat dissipation becomes more difficult due to the enclosed structure
Solution Approach 1:
The patent applies local quality by incorporating heat dissipating fins at specific locations on the seamless frame structure. These fins are strategically positioned to maximize heat dissipation surface area while maintaining the overall enclosed shielding structure, allowing localized thermal management without compromising electromagnetic protection.
Solution Approach 2:
The patent adds a third dimension to heat dissipation by incorporating protruding fins that extend outward from the frame surface. This dimensional addition creates extended heat dissipation surfaces that radiate heat away from the enclosed electronic components while maintaining the integrity of the electromagnetic shielding enclosure.
3Reliability
If the frame and cover are loosely assembled, then manufacturing and assembly are easier, but electromagnetic waves can leak through gaps
Solution Approach 1:
The patent segments the electromagnetic shielding structure into a seamless frame and a separate cover component. The frame is formed as one piece, while the cover is designed to fit over the frame with complementary geometric features. This segmentation allows for easier manufacturing of each component while maintaining tight fit through precise geometric matching.
Solution Approach 2:
The patent employs asymmetric geometric features at the interface between the frame and cover, including non-uniform protrusions and corresponding recesses. This asymmetric design creates a tight, interference-fit connection that prevents electromagnetic wave leakage while maintaining relatively simple manufacturing and assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents electromagnetic wave leakage and permeation while providing efficient heat dissipation for electronic components, enhancing both shielding and thermal management in compact electronic products.
Implementation Method 1
the frame is one-piece and seamless... the cover is combined with the frame; the top portion of the cover is connected to borders of the frame; the side portion is tightly combined with the frame so that the cover, the frame, and the circuit board form a shielding space to surround the electronic element
Implementation Method 2
The heat dissipating element is disposed on the top portion... the electromagnetic shielding device also has a heat dissipating element for directly dissipating heat for the shielded electronic element
Data Source
AI summary
An electromagnetic shielding device with a heat dissipating function for shielding at least one electronic element on a circuit board is provided. The electromagnetic shielding device includes a frame, a cover, and a heat dissipating element. The frame is disposed on the circuit board and surrounds the electronic element, and the frame is one-piece and seamless. The cover has a top portion and a side portion bent from borders of the top portion. The heat dissipating element is disposed on the top portion. The top portion of the cover is connected to borders of the frame, and the side portion is tightly combined with the frame so that the cover, the frame and the circuit board form a shielding space to surround the electronic element.