Seamless Textile Covering for Electronic Devices

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional textile coverings for electronic devices often require seams, which detract from appearance, hinder tactile interactions, and increase manufacturing complexity and cost.

Innovation Solution

A seamless tubular textile covering made from structural fibers, optionally incorporating heat-shrink or adhesive fibers, which can be woven into various patterns and textures to provide a visually appealing and intuitive tactile experience without seams, using techniques like plain weave or incorporating different materials and post-processing treatments.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional textile coverings are used with seams, then structural integrity and ease of manufacture are improved, but appearance quality and tactile experience deteriorate

Engineering Contradiction:
Improveease of manufactureVSAvoidappearance quality
Core Design Contradiction:
Ease of manufactureVSShape

Solution Approach 1:

The patent merges the tube body and end pieces into a single seamless tubular structure. The covering is formed as one continuous piece of textile material without seams or joints, eliminating the visual and tactile defects associated with conventional segmented constructions while maintaining structural integrity through the continuous weave pattern.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent applies segmentation by creating distinct zones within the seamless tube - the main body portion and tapered end pieces - that are formed from the same continuous material but have different geometric characteristics. This allows each zone to serve its specific function while maintaining overall seamlessness.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If conventional textile coverings with seams are used, then manufacturing simplicity is improved, but tactile interaction quality deteriorates

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidtactile interaction quality
Core Design Contradiction:
Ease of manufactureVSEase of operation

Solution Approach 1:

The patent combines the entire covering into a single seamless structure, eliminating joints and seams that would create tactile discontinuities. The continuous textile construction provides uniform surface characteristics across the entire covering, enhancing user comfort and interaction quality.

Inventive Principle:
Principle #5Merging (Combining)

3Shape

If seamless tubular covering is used, then appearance and tactile experience are improved, but manufacturing complexity increases

Engineering Contradiction:
Improveappearance qualityVSAvoidmanufacturing complexity
Core Design Contradiction:
ShapeVSDevice complexity

Solution Approach 1:

The patent employs heat-shrinkable textile material that serves multiple functions: it provides the seamless structural basis, enables form-fitting attachment to the electronic device through thermal contraction, and eliminates the need for separate fastening mechanisms. This multi-functionality reduces overall manufacturing complexity despite the seamless construction requirement.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent utilizes the temperature-dependent dimensional change property of heat-shrinkable material. The covering is manufactured in an expanded state for ease of assembly, then thermally contracted to achieve the final form-fitting configuration. This parameter change simplifies the manufacturing process by enabling simple assembly followed by automated thermal treatment.

Inventive Principle:
Principle #35Parameter changes

4Reliability

If heat-shrinkable material is used, then secure fit and customization are improved, but additional processing steps are required

Engineering Contradiction:
Improvesecure fitVSAvoidprocessing steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The heat-shrinkable property provides dual benefits: it enables form-fitting attachment for secure fit and allows the covering to be customized to different device sizes and shapes. The same material property that creates the secure fit also enables versatility across different electronic device configurations.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent exploits the phase transition behavior of heat-shrinkable polymer materials. The covering transitions from an expanded relaxed state during assembly to a contracted stabilized state when heated, achieving secure attachment. This phase transition is a single automated processing step that replaces multiple manual fastening operations.

Inventive Principle:
Principle #36Phase transitions

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Simplifies manufacturing and assembly while offering a pleasing aesthetic and tactile experience by eliminating seams, guiding user interaction with distinct textures and colors, and facilitating secure, customizable fit through heat-shrink or adhesive properties.

Implementation Method 1

one or more heat-shrink fibers woven into the seamless tube, wherein the heat-shrink fibers shrink when the seamless tube is heated above a threshold temperature, thereby constricting the seamless tube around the electronic device

Methodology Applied
Scientific EffectHeat-shrink: Thermal Contraction

Implementation Method 2

one or more adhesive fibers woven into the seamless tube, wherein the adhesive fibers adhere the textile covering to the electronic device

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentEP3931673B1Textile covering for electronic device
Publication Date: 2023.11.01 MICROSOFT TECHNOLOGY LICENSING LLC
  • EP3931673B1 patent drawingFigure 1
  • EP3931673B1 patent drawingFigure 2
  • EP3931673B1 patent drawingFigure 3

AI summary

Examples are disclosed that relate to textile coverings for electronic devices and methods for manufacturing textile coverings for electronic devices. In one example, a textile covering for an electronic device comprises one or more structural fibers woven into a seamless tube, the seamless tube configured to encircle at least a portion of the electronic device. The textile covering also comprises one or more heat-shrink fibers and/or one or more adhesive fibers woven into the seamless tube. The heat-shrink fibers shrink when the seamless tube is heated above a threshold temperature, thereby constricting the seamless tube around the electronic device. The one or more adhesive fibers adhere the textile covering to the electronic device.