Seamless Tiling Bridge Structure for High-Resolution Displays
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Solution Overview
Problem
Existing tiling approaches for large area electronic systems, such as displays and sensors, face challenges in reducing the space between tiles to achieve higher resolution systems, due to tile bezels, interconnects, and driving parts at the edge of each tile.
Innovation Solution
The method involves connecting an array of tiles with substrates and pixels, distributing signals between pixels in row and column directions, and forming traces to connect pads between adjacent tiles, allowing for seamless alignment and connection while minimizing bezel width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional tiling approaches are used with tile bezels, interconnects, and driving parts at the edge of each tile, then each tile can be independently manufactured and assembled, but the space between tiles increases reducing the overall resolution
Solution Approach 1:
The patent merges the bezel, interconnect, and driving parts into a single integrated structure called a 'bridge structure' that spans the gap between adjacent tiles. This bridge structure contains both the electrical interconnect traces and the mechanical support elements, eliminating the need for separate bezel and interconnect components, thereby reducing the overall space between tiles while maintaining independent manufacturability
Solution Approach 2:
The patent moves the driving parts from the traditional edge-plane location to a three-dimensional bridge structure that extends between tiles. This dimensional transition allows the driving parts to be positioned in the space between tiles rather than occupying edge space, effectively reducing the bezel width and increasing the active display area
2Manufacturing precision
If the space between tiles is reduced to increase resolution, then higher resolution systems are achieved, but the complexity of aligning and connecting adjacent tiles increases
Solution Approach 1:
The patent segments the bridge structure into modular components that can be pre-assembled with tiles and then connected to adjacent tiles. The interconnect traces are segmented into sections on each tile that align and connect through the bridge structure, reducing the overall alignment complexity while maintaining high resolution
Solution Approach 2:
The bridge structure serves as an intermediary element between adjacent tiles, providing both mechanical support and electrical connection. This intermediary structure simplifies the alignment process by providing a defined interface that guides the connection between tiles, reducing the complexity of direct tile-to-tile alignment
3Area of stationary object
If tile bezel width is reduced to increase active area, then transparency and active display area are improved, but the reliability of signal connection between tiles deteriorates
Solution Approach 1:
The patent applies different structural qualities to different regions of the bridge structure. The region containing the interconnect traces has optimized electrical properties for reliable signal transmission, while the mechanical support regions provide structural integrity. This local optimization ensures both transparency and connection reliability without compromising the active display area
Data Source
AI summary
The present disclosure relates to tiling which is one approach to develop large area electronic systems such as displays and sensors. In particular, the invention discloses connecting an array of tiles, an array of pixels and distributing signals between pixels in row and column. In addition, the invention discloses alignment of tiles, differentiability of tiles, sharing pixel circuits between subpixels with different microdevices, and EM signals controlling switches and alignment on opposite surfaces.