S-ECAM Electrode Module for Maskless Bonding Layer Deposition
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Solution Overview
Problem
Conventional methods for forming bonding layers on semiconductor circuit boards using masks are costly, time-consuming, and environmentally harmful due to exposure and strip processes.
Innovation Solution
A selective electrochemical additive manufacturing (S-ECAM) printing device that forms bonding layers without masks by using electrochemical deposition, utilizing an electrode module with an anode and cathode plates, and a controller to electrochemically deposit metal ions on a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mask-based methods are used to form bonding layers, then bonding layer formation is achieved, but equipment cost increases, process time extends, and environmental harm occurs due to exposure and strip processes
Solution Approach 1:
The patent extracts and eliminates the mask from the bonding layer formation process. Instead of using a physical mask that requires exposure and strip processes, the invention directly deposits metal ions onto the substrate through electrochemical deposition, removing the unnecessary mask component and its associated processes while maintaining precise bonding layer formation
Solution Approach 2:
The patent replaces the mechanical/optical mask-based system with an electrochemical deposition system. The mechanical process of mask alignment, exposure, and strip is substituted by an electrochemical process where metal ions are selectively deposited onto the substrate through controlled electrochemical reactions, eliminating complex equipment while achieving the same bonding layer formation function
2Manufacturing precision
If mask-based methods are used to form bonding layers, then bonding layer formation is achieved, but process time increases due to exposure and strip processes
Solution Approach 1:
The patent removes the time-consuming exposure and strip processes by eliminating the mask entirely. The bonding layer is formed directly through electrochemical deposition of metal ions, which eliminates the sequential steps of mask application, exposure, development, and strip that characterize traditional photolithography processes
Solution Approach 2:
The patent enables continuous bonding layer formation through electrochemical deposition. Instead of discrete steps (mask application, exposure, development, strip), the process continuously deposits metal ions onto the substrate as long as voltage is applied and metal ions are available in the electrolyte, significantly reducing total process time while maintaining precise control over bonding layer formation
3Manufacturing precision
If mask-based methods are used to form bonding layers, then bonding layer formation is achieved, but environmental harm increases due to exposure and strip processes
Solution Approach 1:
The patent extracts and eliminates the environmentally harmful exposure and strip processes by removing the mask entirely. The bonding layer formation is achieved through electrochemical deposition using metal ions in an electrolyte solution, which avoids the chemical processes and waste products associated with traditional photolithography
Solution Approach 2:
The patent converts the electrochemical process into an environmentally beneficial method. Instead of using harmful photoresists and chemical developers that require disposal, the process uses metal ions in an electrolyte that can be reused and recycled, transforming a potentially harmful chemical process into a cleaner, more sustainable manufacturing method
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Eliminates the need for masks, reducing equipment costs, process time, and environmental impact by directly depositing metal ions on a substrate.
Implementation Method 1
a power supply configured to supply power by using the electrode as an anode and the substrate as a cathode... to electrochemically deposit metal ions included in the electrolyte on a predetermined area of the substrate
Data Source
AI summary
The present invention relates to a selective electrochemical additive manufacturing (S-ECAM) printing device which can selectively deposit metal raw materials on a substrate using electrochemical additive manufacturing (ECAM). In addition, the present invention relates to an S-ECAM printing device which can form a adhesion layer for mounting a chip on a circuit board without using a mask.