Sectioned Heat Spreader With Multi-Chamber Thermo-Siphon Cooling
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Solution Overview
Problem
Existing thermo siphon cooling devices face high manufacturing costs and complexity due to multiple components, thermal resistance issues between channels and heat sinks, and limitations in heat flow and cooling capacity, especially when dealing with high heat power sources like power amplifiers.
Innovation Solution
The integration of an evaporator, condenser, riser, and downcomer within a single body, with optimized surface areas and conduits for enhanced thermal contact and heat dissipation, reduces thermal resistance and allows for scalable cooling capacity by direct contact between the cooling agent and heat sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple components (channels, evaporator, heat sink) are used in thermo siphon cooling devices, then cooling functionality is achieved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent combines the evaporator, condenser, and heat dissipation fins into a single integrated heat spreading device. The first chamber serves as the evaporator, the second chamber serves as the condenser, and fins are attached to the second chamber for heat dissipation, eliminating the need for separate components and reducing manufacturing complexity while maintaining cooling functionality
Solution Approach 2:
The single body structure performs multiple functions: the first chamber evaporates coolant, the connecting conduit transports vapor, the second chamber condenses vapor, and the attached fins dissipate heat. This multi-functional design replaces multiple separate components with one integrated device
2Reliability
If multiple components are assembled together, then cooling functionality is achieved, but thermal resistance between components increases
Solution Approach 1:
By integrating the evaporator and condenser chambers into a single continuous body with direct thermal contact, the patent eliminates thermal resistance at component interfaces. The fins are directly attached to the second chamber, ensuring efficient heat transfer without intermediate thermal barriers
3Power
If traditional thermo siphon structure is used, then cooling is provided, but cooling capacity is limited for high heat power sources
Solution Approach 1:
The patent extends the heat dissipation function into a third dimension by attaching fins to the second chamber. This increases the heat dissipation surface area without significantly increasing the footprint, enabling the device to handle higher heat loads from power amplifiers and other high-power sources
4Ease of manufacture
If manufacturing process is simplified, then production cost decreases, but manufacturing precision may be compromised
Solution Approach 1:
The integrated single-body design allows the evaporator, condenser, and heat dissipation structures to be manufactured as one piece or pre-assembled unit, simplifying the manufacturing process. The direct thermal contact between components is ensured by the integrated structure, maintaining manufacturing precision without complex assembly procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a cost-effective, efficient cooling solution with reduced thermal resistance, improved heat spreading, and increased cooling capacity, capable of handling higher heat loads while minimizing the risk of liquid exhaustion and providing stable temperature distribution.
Implementation Method 1
heat from a hot place transfers to upper part of equipments via thermo siphon channels
Implementation Method 2
heat from a hot place transfers to upper part of equipments via thermo siphon channels and is distributed to the number of heat fins, where all fins together build up a heat sink
Implementation Method 3
Natural circulation is used and one way is made to circulate through a refrigerant
Implementation Method 4
heat from a hot place transfers to upper part of equipments via thermo siphon channels and is distributed to the number of heat fins, where all fins together build up a heat sink
Data Source
AI summary
A heat spreading device includes sectioning forming a first chamber portion and a second chamber portion, a first plurality of conduits, and a second at least two conduits. The second at least two conduits interconnect the first chamber portion and the second chamber portion. The heat spreading device may also include cavities, a barrier, and fins.