Sectioned Manifolds for Immersion Cooling
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Solution Overview
Problem
The increasing power dissipation in integrated circuit chips poses cooling challenges, particularly in large server applications where traditional air-cooling methods are insufficient, leading to stress on room air-conditioning systems and inefficiencies in liquid-cooling solutions due to temperature gradients and complex plumbing requirements.
Innovation Solution
A cooling apparatus featuring a housing with a coolant loop, pump, and bypass line that immerses electronic components in a dielectric fluid for flow boiling, with a mixed-phase manifold section to facilitate counter-flow cooling of vapor, allowing for efficient heat transfer and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air cooling is used for electronic components, then the system structure is simple, but the cooling efficiency is insufficient for high power dissipation
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a coolant circulation system with pumps, manifolds, and heat exchangers. The liquid coolant directly contacts electronic components through immersion or close proximity channels, enabling efficient heat transfer via convection and phase change, thereby resolving the insufficient cooling efficiency of air cooling while maintaining reasonable system complexity
Solution Approach 2:
The patent utilizes phase change of the coolant (liquid to vapor and back to liquid) as the primary heat transfer mechanism. The coolant absorbs heat from electronic components through evaporation/boiling at the component surface, then condenses in heat exchangers, releasing latent heat. This phase transition process enables high heat flux removal with compact hardware, directly addressing the cooling efficiency limitation
2Temperature
If liquid cooling is used to handle increased power dissipation, then the cooling efficiency improves, but the system complexity and plumbing requirements increase
Solution Approach 1:
The patent combines multiple coolant distribution functions into integrated manifold structures that serve both as flow distribution networks and as mounting structures for electronic components. The manifolds are designed to directly contact multiple components simultaneously, eliminating the need for separate tubing connections to each component, thereby reducing plumbing complexity while maintaining effective liquid cooling
Solution Approach 2:
The coolant loop system is designed to serve multiple electronic components and heat generation sources within a single integrated circulation system. The same coolant flow path and heat exchangers handle thermal management for processors, memory modules, and other high-power components, reducing the need for separate cooling systems and simplifying overall system architecture
3Temperature
If traditional liquid cooling systems are used, then heat transfer efficiency improves, but temperature gradients in the coolant increase energy consumption
Solution Approach 1:
The patent employs phase change of the coolant (evaporation at component surface, condensation in heat exchangers) as the primary heat transfer mechanism. This phase transition process enables high heat flux removal with minimal temperature difference between the coolant and electronic components, reducing the energy required for pumping while maintaining effective cooling
Solution Approach 2:
The patent utilizes the phase change parameters of the coolant (boiling point, latent heat of vaporization) to optimize heat transfer. By operating the coolant at its saturation temperature and utilizing latent heat during phase transition, the system achieves high heat transfer coefficients with minimal temperature gradients, thereby reducing pumping energy requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages high heat fluxes by minimizing temperature gradients and reducing energy consumption, enabling more efficient and cost-effective cooling of dense electronic systems without the need for energy-intensive refrigeration and complex plumbing.
Implementation Method 1
coolant flows through the compartment and at least partially immersion cools the one or more electronic components by, at least in part, flow boiling
Implementation Method 2
the pump facilitates circulation of the coolant within the coolant loop between the supply manifold, the compartment of the housing and the return manifold
Implementation Method 3
Coolant flows from the coolant bypass line into the mixed-phase manifold section of the return manifold in a direction counter to a direction of any coolant vapor flow within the mixed-phase manifold section. The coolant flow from the coolant bypass line facilitates cooling of the coolant vapor flow.
Data Source
AI summary
Cooling apparatuses and methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling apparatus includes a housing forming a compartment about one or more components, a supply manifold, a return manifold, and a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and at least partially immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.