Sector-Shaped Closely-Packed Laser Generator with V-Groove Fiber Arrangement
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Solution Overview
Problem
Existing semiconductor laser generators are limited in achieving miniaturization and light weight due to simple superposing of single die packaging, which restricts their application and popularization, and lack diversity in light emitting directions.
Innovation Solution
A sector-shaped closely-packed laser generator design featuring a module packaging unit with multiple single-die modules and a closely-packed output unit with V-shaped grooves on a silicon wafer, where coupling optical fibers from the modules are arranged in these grooves to control light emitting directions, enabling modularized and integrated packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If simple superposing of single die packaging is used, then the packaging process is simple, but the laser generator cannot achieve miniaturization and light weight
Solution Approach 1:
The packaging structure is divided into multiple layers, with each layer containing single-die modules arranged in a specific pattern. The coupling optical fibers are also segmented and arranged in corresponding layers, allowing for compact integration while maintaining simple individual component structures. This layered segmentation enables miniaturization without excessive complexity.
Solution Approach 2:
The coupling optical fibers are nested within the module packaging structure, with the fibers positioned in grooves on the silicon wafer surface. The single-die modules are integrated with their respective coupling fibers in a nested configuration, achieving compact packaging that reduces overall volume while keeping the packaging process manageable.
2Adaptability or versatility
If traditional single die packaging superposing solution is used, then the packaging method is straightforward, but the light emitting directions are not diversified
Solution Approach 1:
The coupling optical fibers are arranged in asymmetric positions on the silicon wafer surface, with fibers located in grooves that are offset from the center. This asymmetric arrangement enables diversified light emitting directions while maintaining a relatively simple packaging process. The asymmetric positioning allows laser beams to propagate in different directions without requiring complex packaging structures.
3Volume of moving object
If coupling optical fibers are closely arranged in V-shaped grooves, then the laser generator achieves miniaturization, but the manufacturing precision requirement increases
Solution Approach 1:
The V-shaped grooves are pre-formed on the silicon wafer surface before the coupling optical fibers are positioned. This preliminary action provides precise guidance for fiber placement, reducing the actual positioning precision required during assembly. The grooves act as pre-prepared channels that automatically guide the fibers into their final positions, enabling miniaturization while managing manufacturing precision requirements.
4Weight of stationary object
If multiple single-die modules are integrated in module packaging unit, then the laser generator achieves light weight, but the device complexity increases
Solution Approach 1:
Multiple single-die modules are merged into a single module packaging unit, with each module containing a die, heat sink, and coupling optical fiber. The modules are integrated on a silicon wafer substrate, combining multiple functions into a compact structure. This merging reduces the overall weight by eliminating separate packaging structures while managing integration complexity through standardized module design.
Data Source
AI summary
The present disclosure discloses a sector-shaped closely-packed laser generator, comprising a module packaging unit and a closely-packed output unit; the module packaging unit is provided therein with a plurality of single-die modules, and each of the single-die modules has a coupling optical fiber; the closely-packed output unit is provided therein with a silicon wafer whose surface has a plurality of V-shaped grooves, and the plurality of V-shaped grooves are arranged into a sector shape; and the coupling optical fibers of the single-die modules protrude from the module packaging unit and enter the closely-packed output unit, and are arranged in the V-shaped grooves after coating layers being stripped, to emit laser lights in directions of the arrangement of the V-shaped grooves. In the present application, the plurality of single-die modules are collectively disposed in the module packaging unit, and the coupling optical fibers of the single-die modules are led out and arranged in the V-shaped grooves arranged in a sector shape, which realizes the close arrangement of the coupling optical fibers, obtains the effect of modularized and integrated packaging of single die, and effectively reduces the volume of the laser generator. Furthermore, by closely arranging the coupling optical fibers in the V-shaped grooves arranged in a sector shape, the present disclosure can control the light emitting direction of the coupling optical fibers.