Direct-Bonded Security Die for Secure Chip Communication
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Solution Overview
Problem
Existing semiconductor chips lack effective security measures to protect security-sensitive components and communications from unauthorized access, leading to a need for improved encryption and decryption solutions that are cost-effective and efficient.
Innovation Solution
A bonded structure is created by directly bonding a security die with encryption logic and memory to a semiconductor element without adhesives, using obstructive materials and vias to enhance security, and incorporating a protective element with a hard or light-blocking material to inhibit external access.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a security die is directly bonded to a semiconductor element without adhesive, then security is improved and processing cost is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The invention divides the semiconductor system into separate functional components: a semiconductor element and a security die, which are independently manufactured and then bonded together. This segmentation allows each component to be optimized separately while improving overall security through physical separation of sensitive encryption logic from the main processor.
Solution Approach 2:
The invention introduces an intermediary bonding interface between the semiconductor element and security die. This bonding layer serves as a mediator that enables direct bonding without adhesive, providing both mechanical support and electrical connection while maintaining the security benefits of the separated architecture.
2Reliability
If obstructive material is added to protect the security core, then security against hacking is improved, but device complexity increases
Solution Approach 1:
The invention implements a nested protective structure where the security die is embedded within the semiconductor element, and obstructive material is integrated into the bonding interface or positioned between the security die and external environment. This nested arrangement provides multiple layers of protection without significantly increasing overall device footprint or complexity.
Solution Approach 2:
The invention employs composite material structures combining the security die with obstructive materials that have specific properties (such as hardness, light-blocking characteristics, or chemical resistance). These composite structures provide enhanced security protection while maintaining a relatively simple overall device architecture through material-level solutions rather than structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides enhanced security for semiconductor chips by reducing processing costs and improving communication speed, while protecting sensitive information from hacking attempts through direct hybrid bonding and the use of obstructive materials.
Implementation Method 1
the semiconductor element and security die are hybrid bonded such that nonconductive regions of the semiconductor element and the security die are directly bonded and conductive regions of the semiconductor element and the security die are directly bonded
Data Source
AI summary
A bonded structure is disclosed. The bonded structure can comprise a semiconductor element comprising active circuitry and a security die electrically connected and directly bonded to a surface of the semiconductor element without an adhesive along a bonding interface. The security die can include a security core. The security core can contain an encryption logic and a memory. The security core can be configured to decrypt data to be transferred to the active circuitry and to encrypt signals from the active circuitry.