Dynamic Security Fabric Interposer for Secure Heterogeneous IC Packaging

The patent introduces a package substrate as an intermediary component between heterogeneous IC components. This substrate includes a fabric of conductive interconnects that can be selectively activated or deactivated, serving as a mediator that controls signal flow and power distribution across the package. This intermediary structure enables security control over the previously uncontrolled attack surfaces created by heterogeneous integration.

The patent implements dynamic control of the interconnect fabric through selective activation and deactivation of conductive paths. The package substrate can dynamically reconfigure which interconnects are active, allowing the system to adapt its connectivity based on security requirements. This dynamic reconfiguration capability enables the system to maintain security while supporting system scaling and heterogeneity.

The package substrate serves multiple functions simultaneously: it provides mechanical support for heterogeneous components, establishes electrical interconnections between them, and implements security control through selective interconnect activation. This multi-functional substrate consolidates what would otherwise require separate management systems, thereby improving span of control while maintaining the compact heterogeneous integration.

The patent merges the functions of mechanical support, electrical interconnection, and security control into a single package substrate structure. By combining these previously separate functions into one integrated substrate, the system achieves improved span of control while maintaining the space-efficient heterogeneous integration of multiple components.

The patent segments the security control architecture into component-level security features within each IC and package-level security control through the substrate's interconnect fabric. This segmentation allows each component to maintain its own security characteristics while the substrate provides overarching control, managing the complexity by distributing security functions across different levels rather than centralizing them.

The package substrate acts as an intermediary security layer between the individual IC components and the external environment. It provides a centralized point for security control through its configurable interconnect fabric, enabling productivity through component aggregation while managing the architectural complexity by establishing a clear hierarchical security structure.