Security Protection Device Using Winding Conductive Frame

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Solution Overview

Problem

Existing anti-tampering technologies for protecting sensitive data on electronic circuits are vulnerable to attacks due to gaps between layered printed circuit boards, allowing unauthorized access.

Innovation Solution

A security protection device comprising a cover circuit board, a base circuit board, and a security frame with embedded electrically conductive wires forming a winding protection layer around the security frame, which encloses a security zone and connects to an intrusion detection mechanism to automatically destroy or erase data upon detection of unauthorized access.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional layered printed circuit boards are used to form an anti-tampering enclosure, then the structure provides basic protection, but gaps between layers allow attackers to access the protected region

Engineering Contradiction:
Improvesecurity protectionVSAvoidunauthorized access through gaps
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent implements a nested structure where multiple circuit boards are stacked and enclosed within a housing, with each board containing sensitive components within protected regions. The nested arrangement of boards inside the housing creates multiple layers of protection, making it difficult for attackers to access sensitive data without triggering security mechanisms.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent introduces an intermediary security mechanism consisting of conductive adhesive layers and tracing patterns that mediate between the physical structure and security detection. These intermediaries detect tampering attempts by monitoring electrical continuity, alerting security systems when attackers attempt to access protected regions through the gaps.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If multiple printed circuit boards are stacked to form an enclosure, then protection is provided, but the structure remains vulnerable to side attacks and tampering

Engineering Contradiction:
Improvedata protectionVSAvoidside attacks and tampering
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent extends protection from two-dimensional board surfaces to three-dimensional space by enclosing multiple stacked boards within a housing structure. This dimensional transition creates comprehensive protection that addresses attacks from all directions, including side attacks, by surrounding the protected regions with conductive adhesive layers and tracing patterns on all surfaces of the housing.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent uses composite security structures combining conductive adhesive materials with traditional circuit board materials. The conductive adhesive layers are applied to interior surfaces of the housing, creating a composite protective barrier that integrates structural support with tamper-detection functionality, making the enclosure resistant to various tampering methods.

Inventive Principle:
Principle #40Composite materials

3Reliability

If conductive adhesive is applied to interior surfaces of the housing, then tamper detection capability is enhanced, but the manufacturing process becomes more complex

Engineering Contradiction:
Improveintrusion detectionVSAvoidproduction process complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The conductive adhesive serves multiple functions simultaneously: it provides structural bonding between the housing and circuit boards, creates electrical continuity for tamper detection, and forms tracing patterns that monitor intrusion attempts. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process despite the enhanced detection capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent utilizes the electrical conductivity parameter of the adhesive material to enable tamper detection. By selecting adhesives with specific conductive properties and applying them in controlled patterns, the system transforms a simple bonding material into an active security sensor, achieving intrusion detection without adding complex separate sensing systems.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS8953330B2Security protection device and method
Publication Date: 2015.02.10 PAX COMP TECH SHENZHEN
  • US8953330B2 patent drawing
  • US8953330B2 patent drawing
  • US8953330B2 patent drawing

AI summary

A security protection device includes a cover circuit board comprising at least one inner wiring layer and a base circuit board comprising at least one inner wiring layer. The device further includes a security frame between the base circuit board and the cover circuit board, at least one electrically conductive wire being wound and included within the security frame to form at least one winding protection layer around sides of the security frame. The cover circuit board, the security frame, and the base circuit board form an enclosure enclosing a security zone, and the at least one inner wiring layer within the cover circuit board, the at least one inner wiring layer within the base circuit board, and the at least one electrically conductive wire within the security frame are connectable to a security mechanism configured to detect an intrusion into the security zone.