Security Element Transfer Material with Composite Carrier

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Solution Overview

Problem

Existing security element transfer materials face challenges in achieving clean edges and stability during transfer, as they often result in unclean edges and residual film contamination due to the tearing of carrier materials, especially when using UV embossing varnishes and plastic films with low tear resistance.

Innovation Solution

A security element transfer material with a carrier substrate composite of two films permanently bonded by an adhesive layer, using a shadow mask with perforations to prevent sticking and ensure clean edges, and a heat-sealing lacquer for precise application, allowing the functional layers to remain on the substrate while the carrier film remains intact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single carrier film is used for security element transfer, then the structure is simple, but the film tears easily during transfer due to low tear resistance

Engineering Contradiction:
Improvecarrier structureVSAvoidtear resistance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent applies composite materials by bonding two different films (first film and second film) together to form a carrier composite. The first film provides tear resistance while the second film provides release properties, creating a composite structure that simultaneously achieves both tear resistance and easy release of security elements during transfer.

Inventive Principle:
Principle #40Composite materials

2Reliability

If the carrier film is made thicker to prevent tearing, then tear resistance improves, but the transfer precision and edge cleanliness deteriorate

Engineering Contradiction:
Improvetear resistanceVSAvoidtransfer precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent segments the carrier into two distinct functional films with different thicknesses and properties. The first film (with higher tear resistance) can be thinner since it doesn't need to provide release properties, while the second film provides the release function. This segmentation allows each film to be optimized for its specific function, achieving both tear resistance and transfer precision without requiring excessive thickness.

Inventive Principle:
Principle #1Segmentation

3Strength

If heat-sealing lacquer is applied to the entire carrier surface, then bonding is strong, but residues remain on transferred patches from torn film areas

Engineering Contradiction:
Improvebonding strengthVSAvoidfilm residues
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The patent extracts the release function from the entire carrier surface by applying a release layer only to specific areas (the second film), while the first film remains without release layer. This allows the security elements to be cleanly transferred from the first film to the target substrate without carrying residues from torn areas, as the release layer is strategically positioned to prevent adhesion only where needed.

Inventive Principle:
Principle #2Taking out (Extraction)

4Ease of operation

If a release layer is added to prevent sticking, then release ease improves, but the layer structure complexity increases

Engineering Contradiction:
Improverelease easeVSAvoidlayer structure
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent merges the release layer with the second film, making the second film itself serve as the release layer. This integration eliminates the need for a separate release layer component, reducing overall structure complexity while still providing the necessary release function. The second film's material properties are selected to inherently provide release characteristics.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures reliable transfer with clean edges and minimal residual film, maintaining the stability of the carrier film and preventing tears, thus ensuring precise and smooth application of security elements.

Implementation Method 1

a first film (1) and a second film (2), which are permanently bonded together by means of an adhesive layer (10)

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

an adhesive layer, usually made of a heat-seal adhesive or A heat-sealing lacquer that melts during the transfer of the security elements and bonds the security elements to the object to be secured

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 3

A mask layer (4) having at least one recess, which is designed such that the security element layer composite can be bonded to the value document substrate in the region of the at least one recess of the mask layer

Methodology Applied
Scientific EffectPhysical constraint: Physical Containment

Data Source

PatentEP3363652B2Security element transfer material and method for manufacturing the same
Publication Date: 2024.02.28 GIESECKE & DEVRIENT CURRENCY TECHNOLOGY GMBH
  • EP3363652B2 patent drawingFigure 1~4
  • EP3363652B2 patent drawingFigure 5~8
  • EP3363652B2 patent drawingFigure 9~10

AI summary

The invention relates to a security element transfer material comprising: - a security element layer composite having a plurality of layers, including at least one feature layer producing an optically variable effect and an adhesive layer, wherein the feature layer is the layer that faces an observer after a security element has been transferred to a document substrate; - a carrier substrate that is detachably connected to the feature layer of the security element layer composite;- a mask layer having at least one recess, designed in such a way that the security element layer assembly can be bonded to the document substrate in the area of ​​the at least one recess of the mask layer by means of the adhesive layer and then detached from the carrier substrate, wherein bonding of the security element layer assembly to the document substrate and subsequent detachment of the security element layer assembly from the carrier substrate is prevented in the area outside the at least one recess of the mask layer.