Security Transfer Material With Partial Release Layer Contours
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Solution Overview
Problem
Existing methods for producing security elements with optically variable effects are complex, requiring die-cutting operations and stabilizing layers, which complicates the removal of the backing film and can lead to stacking issues.
Innovation Solution
A method for producing a security element transfer material involving a carrier film with a partially applied release layer and an adhesive layer that defines the transfer area, eliminating the need for grid-like stabilizing layers and die-cutting, ensuring precise and simple manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a grid-like stabilizing layer and weeding process are used, then the security element can be detached from the carrier film, but the production process becomes complex and time-consuming
Solution Approach 1:
The patent extracts and removes the grid-like stabilizing layer from the production process. Instead of using a complex stabilizing layer structure, the invention relies on the adhesive layer's selective adhesion properties to achieve detachment, thereby simplifying the production process while maintaining reliable detachment of the security element from the carrier film
Solution Approach 2:
The patent segments the functional layers into distinct components with specific adhesion properties. The adhesive layer is designed to adhere strongly to the security element but weakly to the carrier film, enabling selective detachment without requiring a stabilizing layer. This segmentation allows the security element to be cleanly separated from the carrier film through simple peeling
2Strength
If the adhesive layer extends beyond the functional layer structure, then strong adhesion to substrate is ensured, but the contours of the security element become imprecise
Solution Approach 1:
The patent applies local quality by creating different adhesion characteristics in different regions. The adhesive layer has strong adhesion to the security element (functional layer structure) ensuring strong bonding to the substrate, while having weak adhesion to the carrier film enabling clean detachment. This local differentiation of adhesion properties resolves the contradiction between strong adhesion and precise contours
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for a straightforward production process with precise control over the transfer area, enabling reliable adhesion to the substrate while allowing easy removal of the carrier film, thus avoiding breakage and stacking problems.
Implementation Method 1
a release layer (22) which is applied to the carrier film (16)... using a UV lacquer or wax release layer that adheres weakly to the carrier film
Implementation Method 2
an adhesive layer (50)... ensuring strong adhesion to the substrate for the functional layer structure
Data Source
Figure 1~2
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AI summary
A method for producing a security feature transfer material (10) comprising the following steps: providing a carrier film (16); applying a release layer (22) to the carrier film (16); partially applying one or more superimposed layers to create a functional layer structure (70) exhibiting an optically variable effect, such that its outer contour (71) lies completely on the release layer (22); and applying an adhesive layer (50) to the functional layer structure (70) such that it either exactly covers the functional layer structure (70) or extends a portion beyond the outer contour (71) of the functional layer structure (70) to reach the release layer (22). The disclosure also relates to a corresponding security feature transfer material (10) as such and a method for producing a valuable item (10) using the security feature transfer material (10).The release layer (22) is applied only partially, such that an outer contour (33) of the release layer (22) extends beyond the outer contour (71) of the functional layer structure (70) all around.