See-Through Display Substrate With Single-Crystal MOS Pixels
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Solution Overview
Problem
Existing display devices using thin-film transistors (TFTs) face limitations in miniaturization, carrier mobility, leakage current, and are unsuitable for high-definition, high-speed, and low-power consumption applications.
Innovation Solution
A display device utilizing a first and second single-crystal semiconductor substrate with integrated MOS transistors and light guiding portions to enable miniaturized pixels, high carrier mobility, and reduced power consumption, while maintaining a see-through function.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If TFT is used for display device, then the device can be manufactured with lower complexity, but pixel miniaturization is limited and carrier mobility is low
Solution Approach 1:
The patent changes the semiconductor material parameter from amorphous or polysilicon to single-crystal semiconductor, which fundamentally alters the material properties to achieve high carrier mobility and enable pixel miniaturization while maintaining manufacturing feasibility through wafer bonding technology
2Device complexity
If TFT is used for display device, then the device structure can be simpler, but leakage current during OFF period is large
Solution Approach 1:
The patent changes the semiconductor material from TFT to single-crystal MOS transistor, which fundamentally improves the electrical characteristics to reduce leakage current during OFF period while maintaining device structure simplicity through standard semiconductor fabrication processes
3Speed
If single-crystal semiconductor substrate is used, then carrier mobility is improved and pixel miniaturization is enabled, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the display device into separate substrate layers (first substrate with single-crystal semiconductor and second substrate) that can be manufactured independently with high precision and then integrated through wafer bonding, which distributes the manufacturing precision requirements across multiple manageable components
Solution Approach 2:
The patent uses wafer bonding as an intermediary process to join the first substrate containing the single-crystal semiconductor with the second substrate, which accommodates and compensates for dimensional variations and precision mismatches between the two substrates
4Illumination intensity
If see-through function is implemented with light guiding portions, then transparency is achieved, but device complexity increases
Solution Approach 1:
The patent integrates multiple functions into the single-crystal semiconductor substrate: it serves as both the active transistor substrate and the light guiding structure for see-through function, eliminating the need for separate components and reducing overall device complexity
Solution Approach 2:
The patent merges the transistor functionality and light guiding functionality into a single integrated substrate structure, where the semiconductor substrate itself performs both electrical and optical functions, thereby reducing the number of separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for higher-definition displays with increased functionality, reduced power consumption, and faster processing by miniaturizing pixels and improving carrier mobility, while maintaining transparency.
Implementation Method 1
the first single-crystal semiconductor substrate includes a plurality of light guiding portions that transmit light so as to implement a see-through function
Data Source
AI summary
A display device according to the present invention, includes: a first substrate including a first single-crystal semiconductor substrate provided with a plurality of light emitting portions and with a first drive circuit that drives the plurality of light emitting portions, wherein the first single-crystal semiconductor substrate includes a plurality of light guiding portions that transmit light so as to implement a see-through function.