See-Through Display Pixel Stacking With Integrated Image Sensing
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Solution Overview
Problem
Current semiconductor devices for video see-through displays are limited by their size and complexity, particularly in augmented reality applications, where immersive and efficient synthesis of computer graphics and real-world images is challenging.
Innovation Solution
A semiconductor device is designed with an integrated image sensor and display unit as a single chip, featuring a semiconductor substrate with light sensing elements, color filter layers, microlenses, and through electrodes that electrically connect image sensor pixels to display pixels, allowing for reduced size and improved operational performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If separate image sensor and display units are used, then functional performance is maintained, but device size increases
Solution Approach 1:
The patent combines the image sensor unit and display unit into a single integrated semiconductor device. The image sensor includes light sensing elements on a semiconductor substrate with color filter layers and microlenses, while the display unit includes light emitting elements arranged in corresponding pixel positions. This merging eliminates the need for separate components and reduces overall device volume while maintaining functional performance.
Solution Approach 2:
The patent utilizes vertical stacking to arrange the image sensor and display unit in different spatial dimensions. The image sensor is positioned at a first location and the display unit at a second location, with connection paths extending between them through the substrate. This three-dimensional arrangement allows integration without increasing the planar footprint, effectively reducing device size while managing structural complexity.
2Volume of moving object
If integrated design is used, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The integrated device is manufactured by first forming the image sensor unit as a separate structure on a semiconductor substrate, then forming the display unit as another separate structure. Connection paths are subsequently formed to link the two units. This segmented manufacturing approach allows each unit to be optimized independently while achieving integration, making the complex manufacturing process more manageable.
Solution Approach 2:
The patent embeds connection paths within the substrate structure to connect the image sensor and display unit. The connection paths include through-electrodes that penetrate the substrate and are surrounded by insulating layers, creating a nested structure where connection elements are integrated within the substrate volume rather than adding external complexity.
3Reliability
If through electrodes are used for connection, then electrical connection efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent introduces insulating layers as intermediary structures surrounding the through-electrodes in the connection paths. These insulating layers provide electrical isolation and structural support, enabling reliable electrical connections through the substrate while reducing the precision requirements for electrode placement and alignment during manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated design reduces the size of the display device and enhances operational performance by enabling efficient electrical connections between image sensor and display pixels, improving the synthesis of computer graphics and real-world images in augmented reality applications.
Implementation Method 1
a plurality of light sensing elements in the semiconductor substrate and constituting a plurality of unit image sensor pixels
Implementation Method 2
a plurality of color filter layers on a second surface of the semiconductor substrate such that the plurality of color filter layers at least partially overlap corresponding light sensing elements
Implementation Method 3
a plurality of microlenses on the plurality of color filter layers
Implementation Method 4
a plurality of light emitting elements on the second wiring structure and constituting a plurality of unit display pixels
Data Source
AI summary
Provided is a semiconductor device for video transmission display including a display unit including a plurality of light emitting elements constituting a plurality of unit display pixels, an image sensor unit disposed on the display unit so that the plurality of unit image sensor pixels corresponding to the same color and the plurality of unit display pixels overlap each other at least partially in a vertical direction, and a plurality of connection paths each including at least one through electrode and electrically connecting the plurality of unit image sensor pixels corresponding to the same color to the plurality of unit display pixels.