Seed Metal Layer Etching for Electronic Component Electrodes
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Solution Overview
Problem
The existing methods for forming electrodes in electronic components, which involve etching a seed metal layer, can lead to local thinning or removal of the metal member, resulting in increased resistance or disconnection of the electrode, thereby deteriorating the electrical characteristics and yield of the components.
Innovation Solution
A method is introduced where a seed metal layer with first and second portions is formed, and a plating layer is deposited on the first portion while the second portion is covered. The second portion of the seed metal layer is then etched while the plating layer is covered, to prevent thinning and ensure a stable electrode formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the seed metal layer is etched to remove unnecessary portions, then the electrode structure is formed, but the metal member is locally thinned or removed causing increased resistance or disconnection
Solution Approach 1:
A protective film is formed on the metal member before etching the seed metal layer. This preliminary protective action prevents the etchant from reaching and damaging the metal member, ensuring that the electrode maintains its integrity and continuity while still allowing the seed metal layer to be properly shaped.
Solution Approach 2:
The protective film acts as an intermediary layer between the etchant and the metal member. It selectively protects the metal member during the etching process, allowing the etchant to remove unnecessary portions of the seed metal layer without causing local thinning or removal of the metal member, thus preventing increased resistance or disconnection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the electrical characteristics and yield of electronic components by preventing electrode disconnection and maintaining uniformity in the plating layer, thereby improving the manufacturing process.
Implementation Method 1
forming a plating layer on the first portion of the seed metal layer
Implementation Method 2
The seed metal layer is formed by sputtering, etc. on a surface of the side of the structure
Data Source
AI summary
An electronic component manufacturing method includes preparing a structure including a conductive member, forming a seed metal layer including first and second portions electrically connected to the conductive member on a surface of the structure, forming a plating layer on the first portion of the seed metal layer in a state in which the second portion of the seed metal layer is covered by a first member, forming a conductive second member on the first portion of the seed metal layer via the plating layer, and etching the second portion of the seed metal layer in a state in which the plating layer is covered by the second member.